參數(shù)資料
型號: 530613B00000G
廠商: Aavid Thermalloy
文件頁數(shù): 113/116頁
文件大?。?/td> 0K
描述: HEATSINK TO-220 BLACK 1.18"
產(chǎn)品培訓模塊: How to Select a Heat Sink
產(chǎn)品目錄繪圖: 530613B00000G
標準包裝: 500
類型: 插件板級
冷卻式包裝: TO-220
固定方法: 把緊螺栓
形狀: 矩形
長度: 1.180"(29.97mm)
寬: 1.000"(25.40mm)
機座外的高度(散熱片高度): 0.500"(12.70mm)
溫升時的功耗: 4W @ 80°C
在強制氣流下的熱敏電阻: 在 600 LFM 時為6°C/W
自然環(huán)境下的熱電阻: 16.7°C/W
材質(zhì):
材料表面處理: 黑色陽極化處理
產(chǎn)品目錄頁面: 2670 (CN2011-ZH PDF)
相關產(chǎn)品: HS417-ND - MOUNTING KIT TO-220
其它名稱: 530613B00000
6106B-13
HS230
96
L
ABOR
SA
VING
HEA
T
SINK
T
O
BO
ARD
&
D
EVICE
T
O
H
EA
T
S
INK
MOUNT
S
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Solderable Studs
Studs
Threaded solderable studs are permanently swaged in place
for quick pre-assembly with the transistor. The device is
placed over the stud (s) followed by the lock washer and
nut. This entire component is then dropped into plated-thru
holes in the printed circuit board for wave soldering. The
end of the stud is tin-plated for excellent solderability and
extends only 0.040" below a 0.062" PC board to clear lead
trimming saws.
Device mounting studs for "Thermalloy-origin"
items are available as options on certain vertical
and board mount heat sinks as a labor-saving aid
for mounting semiconductors. This optional feature
speeds production assembly time and reduces
hardware requirements.
Device Mounting Studs
Suffix
Ordering code
Dia of PCB thru hole
“A” Dim
“B” Dim
“C” Dim
Figure
SE-1
08
3.68 (0.145)
8.89 (0.350)
6-32
1.13-1.26 (0.045-0.050)
A
SE-2
06
3.68 (0.145)
12.32 (0.485)
6-32
1.14-1.27 (0.045-0.050)
A
SE-3
09
3.68 (0.145)
8.89 (0.350)
4-40
1.14-1.26 (0.045-0.050)
A
SE-4
14
3.68 (0.145)
8.89 (0.350)
6-32
3.05 (0.120)
B
SM-1
17
3.68 (0.145)
8.89 (0.350)
M3 x 0.5
3.05 (0.120)
B
SM-3
07
3.68 (0.145)
8.89 (0.350)
M3 x 0.5
1.13-1.26 (0.045-0.050)
A
Suffix
Ordering code
“A” Dim
“B” Dim
“C” Dim
“D” Dim
SF1
11
7.92 (0.312)
4-40 UNC-2A
0.25 (0.010)
4.75 (0.187)
SF2
N/A
8.00 (0.315)
M3 x 0.5
0.25 (0.010)
4.60 (0.181)
SF3
N/A
7.92 (0.312)
6-32 UNC-2A
0.25 (0.010)
5.23 (0.206)
"B"
"D"
"A"
"C"
CL
Device
Mounting
Stud
Mechanical drawing showing heat sink with device mounting studs
PC BOARD
"C"
HEAT
SINK
PC BOARD
HEAT
SINK
5.49
(0.216)
"A"
"B"
"C"
501303B000 _ _ G
Ordering code
7022B–
G
B
529801B000 _ _G
Ordering code
7019B–
G
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
A
A = Model number
B = Stud suffix
C = RoHS compliant
A
A = Model number
B = Stud suffix
C = RoHS compliant
FIGURE B
FIGURE A
Typical installation
Note: Factory installed only
C
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相關代理商/技術參數(shù)
參數(shù)描述
530613B05300G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風扇,熱管理 >> 熱敏 - 散熱器 系列:- 產(chǎn)品目錄繪圖:BDN12-3CB^A01 標準包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類(BGA,LGA,CPU,ASIC……) 固定方法:散熱帶,粘合劑(含) 形狀:方形,鰭片 長度:1.21"(30.73mm) 寬:1.210"(30.73mm) 直徑:- 機座外的高度(散熱片高度):0.355"(9.02mm) 溫升時的功耗:- 在強制氣流下的熱敏電阻:在 400 LFM 時為6.8°C/W 自然環(huán)境下的熱電阻:19.6°C/W 材質(zhì):鋁 材料表面處理:黑色陽極化處理 產(chǎn)品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
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