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參數(shù)資料
| 型號： | 53253-104 |
| 廠商： | MICROPAC INDUSTRIES INC |
| 元件分類： | 繼電器，輸入/輸出模塊 |
| 英文描述： | DUAL TRANSISTOR OUTPUT SOLID STATE RELAY, 1000 V ISOLATION-MAX |
| 封裝： | HERMETIC SEALED, CERAMIC, DIP-8 |
| 文件頁數(shù)： | 7/7頁 |
| 文件大小： | 165K |
| 代理商： | 53253-104 |
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281
www.micropac.com
E-MAIL: microsales@micropac.com
3/8/07
Rev C
Pg. 7 of 7
53253
Radiation Tolerant Dual Power MOSFET Optocouplers
Ordering Guide
The following chart explains the ordering procedure for Micropac Part Numbers.
Please contact Micropac for other desired options.
Mii DASH NO.
PIN STYLE
LEAD FINISH
SCREENING LEVEL PER MIL-PRF-38534
53253-101
DIP Case P
Solder Dip
No Screening
53253-102
DIP Case P
Gold Plate
No Screening
53253-103
DIP Case P
Solder Dip
Screening To H Level
53253-104
DIP Case P
Gold Plate
Screening To H Level
53253-105
DIP Case P
Solder Dip
Screening To “K” Level
53253-106
DIP Case P
Gold Plate
Screening To “K” Level
53253-107
DIP Case P
Solder Dip
“H” Level
53253-108
DIP Case P
Gold Plate
“H” Level
53253-109
DIP Case P
Solder Dip
“K” Level
53253-110
DIP Case P
Gold Plate
“K” Level
53253-111
Gull Wing Case X
Solder Dip
Screening To “H” Level
53253-112
Gull Wing Case X
Gold Plate
Screening To “H” Level
53253-113
Gull Wing Case X
Solder Dip
Screening To “K” Level
53253-114
Gull Wing Case X
Gold Plate
Screening To “K” Level
53253-115
Gull Wing Case X
Solder Dip
No Screening
53253-116
Gull Wing Case X
Gold Plate
No Screening
53253-117
Gull Wing Case X
Solder Dip
“H” Level
53253-118
Gull Wing Case X
Gold Plate
“K” Level
53253-119
Gull Wing Case X
Solder Dip
“K” Level
53253-120
Gull Wing Case X
Gold Plate
“K” Level
53253-121
Gull Wing Case Y
Solder Dip
No Screening
53253-122
Gull Wing Case Y
Gold Plate
No Screening
53253-123
Gull Wing Case Y
Solder Dip
Screening To “H” Level
53253-124
Gull Wing Case Y
Gold Plate
Screening To “H” Level
53253-125
Gull Wing Case Y
Solder Dip
Screening To “K” Level
53253-126
Gull Wing Case Y
Gold Plate
Screening To “K” Level
53253-127
Gull Wing Case Y
Solder Dip
H Level
53253-128
Gull Wing Case Y
Gold Plate
H Level
53253-129
Gull Wing Case Y
Solder Dip
K Level
53253-130
Gull Wing Case Y
Gold Plate
K Level
Note: “Screening” to H or K Level is to MIL-PRF-38534 Table CIX Screening only. Element Evaluation
and QCI is not included
.
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| 53253-1110 | 功能描述:CONN HEADER 11POS 2MM VERT TIN RoHS:否 類別:連接器，互連式 >> 矩形- 接頭，公引腳 系列:Micro-Latch™ 53253 標(biāo)準(zhǔn)包裝:2,000 系列:KK® 42228 觸點(diǎn)類型：:公形引腳 連接器類型:接頭，無罩，可斷開式 位置數(shù):4 加載位置的數(shù)目:全部 間距:0.100"（2.54mm） 行數(shù):1 行間距:- 觸點(diǎn)接合長度:0.295"（7.49mm） 安裝類型:通孔，直角 端子:焊接 緊固型:摩擦鎖 特點(diǎn):- 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:15µin（0.38µm） 顏色:黑 包裝:散裝 其它名稱:0022-28-1041002228-104122-28-104122281041 |
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