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參數(shù)資料
| 型號(hào)： | 5595 210 MM X 300 MM 1.5 MM |
| 廠商： | 3M |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | THERM PAD 5595 210X300MM 1.5MM |
| 特色產(chǎn)品： | Thermal Interface Materials |
| 標(biāo)準(zhǔn)包裝： | 25 |
| 系列： | 5595 |
| 使用： | 片狀 |
| 形狀： | 矩形 |
| 外形： | 210.00mm x 300.00mm |
| 厚度： | 0.059"（1.50mm） |
| 材質(zhì)： | 硅質(zhì) |
| 膠合劑： | 膠粘 - 兩側(cè) |
| 顏色： | 灰 |
| 導(dǎo)熱性： | 1.6 W/m-K |
| 其它名稱： | 3M9606 WX300902268 |
3M
Thermally Conductive Interface Pads 5595 and 5595S
(3)
3M Thermally Conductive Interface Pads
5506
0.5 to 2.0
2.3
5509
0.5 to 2.0
5.0
General Information
Product selection table for 3M Thermally Conductive Materials.
Bulk Thermal
Thickness
Conductivity
Product
(mm)
(W/m-K)
Typical Applications
3M Thermally Conductive Tapes
8805
0.127
8810
0.25
0.6
8815
0.375
8820
0.50
9889FR
1.0
0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
IC packages and PCB bonding to heat sinks, metal cases and other cooling
devices.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M Thermally Conductive Adhesives
TC-2707
—
0.7
TC-2810
—
1.0 - 1.4
Applications requiring high adhesive strength, good surface wetting, gap
filling and good thermal transfer. IC package and PCB thermal interfacing
with heat sinks or other cooling devices.
3M Thermally Conductive Interface Pads (acrylic)
5590H
0.5 to 1.5
3.0
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M Thermally Conductive Interface Pads (silicone based)
5591S
0.5 to 2.0
1.0
5592
1.0 to 2.0
1.1
5592S
0.5 to 2.0
—
5595
1.0 to 2.0
1.6
5595S
0.5 to 2.0
—
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
Application Ideas
3M Thermally Conductive Interface Thermal Pads are designed to provide a preferential heat-transfer path between
heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
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