參數(shù)資料
型號(hào): 5962-0051207Q2A
廠商: TEXAS INSTRUMENTS INC
元件分類(lèi): 運(yùn)算放大器
英文描述: DUAL OP-AMP, 2200 uV OFFSET-MAX, 5.2 MHz BAND WIDTH, CQCC20
封裝: CERAMIC, LCC-20
文件頁(yè)數(shù): 21/70頁(yè)
文件大?。?/td> 1976K
代理商: 5962-0051207Q2A
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA
FAMILY OF LOW POWER RAILTORAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS220J JULY 1998 REVISED FEBRUARY 2004
28
WWW.TI.COM
APPLICATION INFORMATION
general power dissipation considerations
For a given
θJA, the maximum power dissipation is shown in Figure 53 and is calculated by the following formula:
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of THS246x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
1
0.75
0.5
0
55 40 25 10 5
Maximum
Power
Dissipation
W
1.25
1.5
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1.75
20 35 50
0.25
TA Free-Air Temperature °C
2
65 80 95 110 125
MSOP Package
Low-K Test PCB
θJA = 260°C/W
TJ = 150°C
PDIP Package
Low-K Test PCB
θJA = 104°C/W
SOIC Package
Low-K Test PCB
θJA = 176°C/W
SOT-23 Package
Low-K Test PCB
θJA = 324°C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 53. Maximum Power Dissipation vs Free-Air Temperature
相關(guān)PDF資料
PDF描述
5962-0051207QCA DUAL OP-AMP, 2200 uV OFFSET-MAX, 5.2 MHz BAND WIDTH, CDIP14
5962-0051201Q2A OP-AMP, 2200 uV OFFSET-MAX, 5.2 MHz BAND WIDTH, CQCC20
5962-0051201QHA OP-AMP, 2200 uV OFFSET-MAX, 5.2 MHz BAND WIDTH, CDFP10
5962-0051201QPA OP-AMP, 2200 uV OFFSET-MAX, 5.2 MHz BAND WIDTH, CDIP8
5962-0051202Q2A OP-AMP, 1700 uV OFFSET-MAX, 5.2 MHz BAND WIDTH, CQCC20
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