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參數(shù)資料
| 型號(hào)： | 5962-8865002RX |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20 |
| 封裝： | CERAMIC, DIP-20 |
| 文件頁(yè)數(shù)： | 5/12頁(yè) |
| 文件大?。?/td> | 359K |
| 代理商： | 5962-8865002RX |
+3.3V/+5V, 8-Channel, Cascadable Relay Drivers
with Serial/Parallel Interface
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +3V to +5.5V, VCOM = VCC, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC, COM..............................................................-0.3V to +6.0V
OUT_........................................................-0.3V to (VCOM + 0.3V)
CS, SCLK, DIN, SET, RESET, A0, A1, A2, LVL......-0.3V to +6.0V
DOUT..........................................................-0.3V to (VCC + 0.3V)
Continuous OUT_ Current (all outputs turned on) ............150mA
Continuous OUT_ Current (single output turned on) ........300mA
Continuous Power Dissipation (TA = +70°C)
20-Lead Thin QFN (derate 16.9mW/°C above +70°C)..1350mW
θJA (Note 1) ...............................................................59.3°C/W
20-Pin TSSOP (derate 21.7mW/°C above +70°C) .....1739mW
θJA (Note 1) ..................................................................46°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature (10s) ...........................................+300°C
Reflow Temperature.........................................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage
VCC
2.3
5.5
V
VCC = 3.6V
15
50
Quiescent Current
IQ
IOUT_ = 0A,
logic inputs = 0V or VCC
VCC = 5.5V
20
70
A
Thermal Shutdown
160
°C
Power-On Reset
0.8
1.5
2.2
V
Power-On Reset Hysteresis
140
mV
DIGITAL INPUTS (SCLK, DIN, CS, LVL, A0, A1, A2, RESET, SET)
VCC = 3.3V
2.0
Input Logic-High Voltage
VIH
VCC = 5V
2.4
V
VCC = 3.3V
0.6
Input Logic-Low Voltage
VIL
VCC = 5V
0.8
V
Input Logic Hysteresis
VHYST
150
mV
Input Leakage Currents
ILEAK
Input voltages = 0V or 5.5V
-1.0
0.01
+1.0
A
CIN Input Capacitance
CIN
5pF
DIGITAL OUTPUT (DOUT)
DOUT Low Voltage
VOL
ISINK = 6mA
0.4
V
DOUT High Voltage
VOH
ISOURCE = 0.5mA
VCC - 0.5
V
RELAY OUTPUT DRIVERS (OUT1–OUT8)
VCC = 2.7V
70
OUT_ Drive Current
VCC = 4.5V
70
mA
OUT_ On-Resistance
RON
VCC = 2.7V
2
6
Ω
OUT_ Voltage
VOUT_VCC = 3.0V, IOUT_ = 70mA
0.4
V
IOUT Off-Leakage Current
ILEAK
VOUT_ = VCC, all outputs off
-1
+1
A
Kickback Diode Forward Voltage
VFORW
IOUT_ = 150mA (Note 3)
1.5
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specifications. For detailed information on
package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
MAX4820/MAX4821
2
Maxim Integrated
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