參數(shù)資料
型號: 5962-9088108QPA
廠商: TEXAS INSTRUMENTS INC
元件分類: 運算放大器
英文描述: OP-AMP, 300 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, CDIP8
封裝: CERAMIC, DIP-8
文件頁數(shù): 45/76頁
文件大?。?/td> 1588K
代理商: 5962-9088108QPA
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D FEBRUARY 1997 REVISED NOVEMBER 2010
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLE2022Y chip information
This chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
OUT
IN +
IN
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
IN +
IN
OUT
(4)
VCC
80
86
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
相關PDF資料
PDF描述
5962-9088202M2A DUAL OP-AMP, 1250 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CQCC20
5962-9088202MPA DUAL OP-AMP, 1250 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP8
5962-9088204Q2A DUAL OP-AMP, 750 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CQCC20
5962-9088204QPA DUAL OP-AMP, 750 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP8
5962-9088201M2A OP-AMP, 700 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CQCC20
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