參數(shù)資料
型號(hào): 5962-9566603QHA
廠商: TEXAS INSTRUMENTS INC
元件分類: 運(yùn)算放大器
英文描述: DUAL OP-AMP, 1000 uV OFFSET-MAX, 0.187 MHz BAND WIDTH, CDFP10
封裝: CERAMIC, DFP-10
文件頁(yè)數(shù): 12/61頁(yè)
文件大小: 1557K
代理商: 5962-9566603QHA
TLV225x, TLV225xA
Advanced LinCMOS RAILTORAIL
VERY LOW POWER OPERATIONAL AMPLIFIERS
SLOS185D FEBRUARY 1997 REVISED AUGUST 2006
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2252 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CERAMIC
FLATPACK
(U)
40
°C to 125°C
850
V
TLV2252AID
TLV2252AIP
TLV2252AIPWLE
40
°C to 125°C
850
V
1500
V
TLV2252AID
TLV2252ID
TLV2252AIP
TLV2252IP
TLV2252AIPWLE
40
°C to 125°C
850
V
TLV2252AQD
40
°C to 125°C
850
V
1500
V
TLV2252AQD
TLV2252QD
55
°C to 125°C
850
V
1500
V
TLV2252AMFK
TLV2252MFK
TLV2252AMJG
TLV2252MJG
TLV2252AMU
TLV2252MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2252CDR).
The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.
TLV2254 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLATPACK
(W)
40
°C to 125°C
850
V
TLV2254AID
TLV2254AIN
TLV2254AIPWLE
40
°C to 125°C
850
V
1500
V
TLV2254AID
TLV2254ID
TLV2254AIN
TLV2254IN
TLV2254AIPWLE
40
°C to 125°C
850
V
TLV2254AQD
40
°C to 125°C
850
V
1500
V
TLV2254AQD
TLV2254QD
55
°C to 125°C
850
V
1500
V
TLV2254AMFK
TLV2254MFK
TLV2254AMJ
TLV2254MJ
TLV2254AMW
TLV2254MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2254CDR).
The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.
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