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參數(shù)資料
| 型號： | 5962F9669601VXX |
| 廠商： | INTERSIL CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28 |
| 封裝： | CERAMIC, DIP-28 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 193K |
| 代理商： | 5962F9669601VXX |
4
Die Characteristics
DIE DIMENSIONS:
180 mils x 197 mils x 21
±1 mils
INTERFACE MATERIALS:
Glassivation:
Type: SiO2
Thickness: 8k
±1k
Top Metallization:
Metal 1 - Type: Moly/TiW
Thickness: 5.8k
±10%
Metal 2- Type: Al/Si/Cu
Thickness: 10k
±10%
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
VDD
ADDITIONAL INFORMATION:
Worst Case Current Density:
Metal 1 - Designs using the Intersil AVLSI-1RA process
take advantage of the superior current carrying
capabilities of Moly.TiW. The current density limit
established by Intersil Reliability is 5.0 x 105 A/cm2
Metal 2 - 1.63 x 105 A/cm2
Process:
AVLSI1RA
Metallization Mask Layout
HS-9008RH
VDDD2
VSSA2
VREF-
VDDA2
B1
B2
B3
B4
CLK
1/2R
VSSD1
VIN
VSSD2
VDDD1
VSSA1
VREF+
VDDA1
OF
B8
B7
B6
B5
VSSA3
VSSD3
VDDD3
VDDA3
CE2
CE1
HS-9008RH
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| 5962F9669601VYC | 制造商:Harris Corporation 功能描述: |
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