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參數(shù)資料
| 型號： | 599-11-676-13-000428 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA676, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 131K |
| 代理商： | 599-11-676-13-000428 |
ProductNumber:599-11-676-13-000428
676-13-000
26X26
Description:
BGA Socket
1mm Grid; BGA Socket
Surface Mount
Accepts .008-.013" Leads
PlatingCode:
11
ShellPlating:
10 μ" Gold over 100 μ" Nickel
InnerContactPlating:
10 μ" Gold over 50 μ" Nickel
#
Of
Pins
Mill-Max
Part
Number
RoHS
Compliant
676
599-11-676-13-000428
CONTACT:
Contact Used: #04, Standard 3 Finger Contact
CurrentRating= 2 Amps
BERYLLIUMCOPPERALLOY 172 (UNS C17200) per
ASTM B 194
PropertiesofBERYLLIUMCOPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Hardness: 36-43 Rockwell C
Mechanical Life: 100 Cycles Min.
Density: .298 lbs/in3
Electrical Conductivity: 22% IACS*
Resistance: 10 miliohms Max
Operating Temperature: -55°C/+125°C
Melting point: 980°C/865°C (liquidus/solidus)
Stress Relaxation: 96% of stress remains after
1,000 hours @ 100 °C ; 70% of stress remains
after 1,000 hours @ 200 °C
*International Annealed Copper Standard, i.e. as a % of pure copper.
Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For
applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.
Mill-Max Mfg. Corp. Datasheet — Last Modified 2/20/2011
Page 1 of 3
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