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參數(shù)資料
| 型號： | 60MT80KPBF |
| 廠商： | VISHAY INTERTECHNOLOGY INC |
| 元件分類： | 橋式整流 |
| 英文描述： | 3 PHASE, 75 A, 800 V, SILICON, BRIDGE RECTIFIER DIODE |
| 封裝： | LEAD FREE, INT-A-PAK-6 |
| 文件頁數(shù)： | 2/8頁 |
| 文件大小： | 159K |
| 代理商： | 60MT80KPBF |
www.vishay.com
For technical questions, contact: ind-modules@vishay.com
Document Number: 94356
2
Revision: 29-Apr-08
60-70MT..KPbF Series
Vishay High Power Products
Three Phase Bridge
(Power Modules), 60/70 A
FORWARD CONDUCTION
PARAMETER
SYMBOL
TEST CONDITIONS
60MT.K
70MT.K
UNITS
Maximum DC output
current at case temperature
IO
120° rect. conduction angle
60 (75)
70 (90)
A
85 (61)
85 (57)
°C
Maximum peak, one-cycle
forward, non-repetitive
surge current
IFSM
t = 10 ms
No voltage
reapplied
Initial
TJ = TJ
maximum
420
480
A
t = 8.3 ms
440
500
t = 10 ms
100 % VRRM
reapplied
350
400
t = 8.3 ms
370
420
Maximum I2t for fusing
I2t
t = 10 ms
No voltage
reapplied
870
1150
kA2s
t = 8.3 ms
790
1050
t = 10 ms
100 % VRRM
reapplied
610
800
t = 8.3 ms
560
730
Maximum I2
√t for fusing
I2
√t
t = 0.1 to 10 ms, no voltage reapplied
8700
11 300
A2
√s
Low level value of threshold voltage
VF(TO)1
(16.7 % x
π x I
F(AV) < I < π × IF(AV)), TJ maximum
0.85
0.86
V
High level value of threshold voltage
VF(TO)2
(I >
π x I
F(AV)), TJ maximum
1.07
1.08
Low level value of forward slope resistance
rf1
(16.7 % x
π x I
F(AV) < I < π × IF(AV)), TJ maximum
8.04
7.35
m
Ω
High level value of forward
slope resistance
rf2
(I >
π x I
F(AV)), TJ maximum
7.08
6.53
Maximum forward voltage drop
VFM
Ipk = 100 A, TJ = 25 °C, tp = 400 s single junction
1.75
1.55
V
RMS isolation voltage
VISOL
TJ = 25 °C, all terminal shorted
f = 50 Hz, t = 1 s
4000
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
60MT.K
70MT.K
UNITS
Maximum junction operating and
storage temperature range
TJ, TStg
- 40 to 150
°C
Maximum thermal resistance,
junction to case
RthJC
DC operation per module
0.37
0.29
K/W
DC operation per junction
2.22
1.75
120° rect. conduction angle per module
0.40
0.34
120° rect. conduction angle per junction
2.42
2.01
Maximum thermal resistance,
case to heatsink per module
RthCS
Mounting surface smooth, flat and greased
0.03
Mounting torque ± 10 %
to heatsink
A mounting compound is recommended and
the torque should be rechecked after a period
of 3 hours to allow for the spread of the
compound. Lubricated threads.
4 to 6
Nm
to terminal
3 to 4
Approximate weight
176
g
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