參數(shù)資料
型號(hào): 61053-003L
廠商: MICROPAC INDUSTRIES INC
元件分類(lèi): 光敏三極管
英文描述: PHOTO TRANSISTOR DETECTOR
封裝: HERMETIC SEALED, PIGTAIL PACKAGE-2
文件頁(yè)數(shù): 1/3頁(yè)
文件大小: 94K
代理商: 61053-003L
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION
725 E.Walnut St., Garland, TX 75040 (972)272-3571 Fax (972)487-6918
www.micropac.com
E-MAIL: OPTOSALES @ MICROPAC.COM
61053
SILICON PHOTOTRANSISTOR, “PIGTAIL PACKAGE”
06/23/03
Features:
Hermetically sealed
Narrow receiving angle
Suitable for high-density mounting
Welded loop lead available
Applications:
Incremental encoding
Reflective sensors
Position sensors
Level sensors
DESCRIPTION
The 61053 is an N-P-N Planar Silicon phototransistor in a small outline package designed to be housing mounted. It is
available in a range of sensitivities and is lensed for minimum response to stray light. High sensitivity, low dark current
leakage, and low saturation voltage make this device ideal for interfacing with TTL circuits. This sensor is also available with
a lead attached to the case so that it may be connected without the use of printed circuit boards. Available custom binned to
customer specifications or screened to MIL-PRF-19500.
ABSOLUTE MAXIMUM RATINGS
Collector-Emitter Voltage........................................................................................................................................................50V
Emitter-Collector Voltage..........................................................................................................................................................7V
Operating Temperature .....................................................................................................................................-55°C to +125°C
Storage Temperature..........................................................................................................................................-65°C to +150°C
Power Dissipation (Derate at the rate of 0.5 mW/°C above 25°C) ...................................................................................50mW
Lead Soldering Temperature (10 second, 1/16” from case) ............................................................................................. 240°C
Package Dimensions
Schematic Diagram
C
E
0.020 [0.51]
0.095 [2.41]
0.077 [1.96]
0.063 [1.60]
1.100 [27.94] TYP.
0.020 [0.51]
COLLECTOR
0.114 [2.90]
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
0.089 [2.26]
1.000 [25.40]
EMITTER
OPTIONAL
MICROPAC
OPTOELECTRONIC PRODUCTS
DIVISION
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