參數(shù)資料
型號： 6382BG
廠商： Aavid Thermalloy
文件頁數(shù)： 34/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 500
類型： 插件板級，垂直
冷卻式包裝： TO-218，TO-220，TO-247，Multiwatt（雙路）
固定方法： 螺栓固定和 PC 引腳
形狀： 矩形
長度： 2.000"（50.80mm）
寬： 1.650"（41.91mm）
機(jī)座外的高度（散熱片高度）： 1.000"（25.40mm）
溫升時(shí)的功耗： 2W @ 20°C
在強(qiáng)制氣流下的熱敏電阻： 在 200 LFM 時(shí)為3.5°C/W
自然環(huán)境下的熱電阻： 4.2°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 041524
24
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5731
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
1.3
(0.05)
8.00
(0.315)
22.86
(0.900)
10.16
(0.400)
10.41
(0.410)
8.13
(0.320)
Part Number
Packaging
573100D00010G
13" Reel, 250 per reel
573100D00000G
Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
25
0
20
40
60
80
100
0.0
0.5
1.0
1.5
2.0
2.5
20
15
5
10
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
ORDERING INFORMATION
1.3
(0.05)
12.70
(0.500)
26.16
(1.030)
10.16
(0.400)
12.70
(0.500)
7.37
(0.290)
Part Number
Packaging
573300D00010G
13" Reel, 250 per reel
573300D00000G
Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5733
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
7106
Surface mount heat sink for D
2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Part Number
Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG
Bulk, 500 per bag
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
SMT
See page 25 for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Refer to Figure C on page 26 for board footprint information
25.91
(1.020)
10.16
(0.400)
7.62
(0.300)
9.52
(0.375)
14.99
(0.590)
10.92
(0.430)
14.99
(0.590)
5.33
(0.210)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
相關(guān)PDF資料
PDF描述
6412M FAN 12VDC AXIAL 172X150X50.8MM
6424H FAN 24VDC AXIAL 172X150X50.8MM
6424M FAN 24VDC AXIAL 172X150X50.8MM
6424 FAN 24VDC 172X150X50.8MM
6448H FAN 48VDC AXIAL 172X150X50.8MM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
6382G1 功能描述:重負(fù)荷電源連接器 SBX175 HOUSING ONLY ORANGE RoHS:否 制造商:Hirose Connector 系列:PS2 產(chǎn)品類型:Connectors 位置/觸點(diǎn)數(shù)量: 端接類型:Crimp 觸點(diǎn)材料: 觸點(diǎn)電鍍:Gold 電壓額定值: 電流額定值:300 A 附件類型:
6382HPU 制造商:EBMPAPST 制造商全稱:ebm-papst 功能描述:DC axial fan
6382P-12 制造商:Olympic Wire & Cable Corp 功能描述:Cord; 2; 0.180 in.; 12 in.; 23 AWG; 120 V (Max.); 1 A; Black; UL Listed
6382P-24 制造商:Olympic Wire & Cable Corp 功能描述:Cord; 2; 0.180 in.; 24 in.; 23 AWG; 120 V (Max.); 1 A; Black; UL Listed
6382P-36 制造商:Olympic Wire & Cable Corp 功能描述:Cord; 2; 0.180 in.; 36 in.; 23 AWG; 120 V (Max.); 1 A; Black; UL Listed
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*