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參數(shù)資料
| 型號(hào)： | 643236-1 |
| 廠商： | Tyco Electronics |
| 元件分類： | 終端 |
| 英文描述： | .250" Centerline, 600 V, 19 – 36 A max |
| 中文描述： | .250" 間距，600 V，19 – 36 A 最大值 |
| 文件頁(yè)數(shù)： | 3/6頁(yè) |
| 文件大?。?/td> | 1407K |
| 代理商： | 643236-1 |
te.com/powerconnectors
2-Piece Power Connectors
TE Connectivity
Application: Backplanes
PRODUCTS
Amps/Linear Inch
Universal Power Module
MULTIGIG RT
ICCON
MINIPAK HDE
Stacked ICCON
< 125
l
125 – 175
l
175 – 225
l
> 225
l
Universal Power Module (UPM)
Connectors (Slim UPM shown)
Varieties of UPM include: standard,
high current, slim, low profile
2 performance levels
Standard 10 amp contact
High current 16 Amp contacts
True hot-plug contacts
High reliability — up to 250 cycles
Different configurations include right
angle, vertical, coplanar and mezzanine
Reference Part Numbers*
1903977-1 (Slim UPM), 1645498-2
(Vertical Plug), 5646954-2 (R/A Plug)
MULTIGIG RT Connectors
2 mm backplane connectors
20 Amp contacts
Three contact mating lengths are
available in 1.5 mm sequence levels
1 and 2 row versions to provide maximum
trace routing flexibility
True hot-plug contacts
Reference Part Numbers*
1-1410271-1 (Plug)
1410270-2 (Receptacle)
ICCON Connectors
With and without locking feature
35A current rating
Slimline version available, 30% smaller
footprint
Board-to-board, board–to-busbar, and
wire-to-board application options
Durable, quick connect/disconnect
function for high current space
constrained applications
Reference Part Numbers*
6643274-1 (Vertical Pin),
6643228-1 (R/A Pin),
6643220-1 (SLIMLINE Socket)
MINIPAK HDE Connectors
Designed to compliment other backplane
connectors offered by TE including
Z-PACK HM-Zd, Z-PACK TinMan and
other connectors
Very high current density — 18 Amps
per contact, over 250 Amps/linear inch
Two levels of contact sequencing for
mate-first-break-last operation
Reference Part Numbers*
1926226-1 (2x6), 1926229-1 (2x9)
Stacked ICCON Connector
Very High Current Density — Up to
200 Amps per inch
Occupies less PCB edge space than
separate ICCON power and guide
modules
Designed to compliment Z-PACK and
other backplane connectors
Right angle connector to mate
motherboard-to-daughterboard
power distribution systems
Ground pin, power pin and
mate-first-break-last pin options
Reference Part Numbers*
2085181-1 (R/A Socket)
1766663-1 (Vertical Pin)
te.com/products/minipakhde
*Part numbers listed are examples of some available samples, please visit website for additional and mating part numbers.
te.com/products/iccon
te.com/products/upm
te.com/products/iccon
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 643236-2 | 功能描述:電源到板 08P UMNL HDR ASSY R/ 1120 RoHS:否 制造商:TE Connectivity / AMP 系列:5787444 產(chǎn)品類型:Connectors 觸點(diǎn)類型: 電壓額定值:50 V 電流額定值: 節(jié)距: 位置/觸點(diǎn)數(shù)量:5 安裝風(fēng)格:Through Hole 端接類型: 觸點(diǎn)電鍍:Tin |
| 643237-1 | 功能描述:08P UMNL HDR ASSY R/A NATL RoHS:是 類別:連接器，互連式 >> 矩形- 接頭，插座，母插口 系列:Universal MATE-N-LOK RoHS指令信息:5535512-4 Statement of Compliance 標(biāo)準(zhǔn)包裝:1,053 系列:AMPMODU Mod II 連接器類型:插座 觸點(diǎn)類型：:母形插口 位置數(shù):34 加載位置的數(shù)目:全部 間距:0.100"（2.54mm） 行數(shù):2 行間距:0.100"（2.54mm） 安裝類型:通孔，直角 端子:焊接 緊固型:- 特點(diǎn):- 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:30µin（0.76µm） 顏色:黑 包裝:管件 |
| 64324-010 | 制造商:FCI 功能描述:CABLE ASSEMBLY - Bulk |
| 643241019 | 制造商:Molex 功能描述: |
| 64324-1019 | 功能描述:汽車連接器 2.8MM FEM TERM SN PLTD 3-5MM WIRE RoHS:否 制造商:Amphenol SINE Systems 產(chǎn)品:Contacts 系列:ATP 位置數(shù)量: 型式:Female 安裝風(fēng)格: 端接類型: 觸點(diǎn)電鍍:Nickel |
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