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| 型號： | 73M1903-EVM-600 |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 42/47頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD DEMO 73M1903 PPU USA/JAPAN |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 1 |
| 主要目的： | 接口，模擬前端（AFE） |
| 已用 IC / 零件： | * |
| 主要屬性： | * |
| 次要屬性： | * |
| 已供物品： | * |
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DS_1903_032
73M1903 Data Sheet
Rev. 2.1
47
Revision History
Rev. #
Date
Comments
1.0
4/16/2004
First publication.
1.1
12/13/2004
Minor format modification.
1.2
7/15/2005
Company logo change and minor format modification.
1.4
9/14/2006
Corrected QFN pin-out drawing.
1.5
5/23/2007
Added 20-VT package information.
1.6
12/14/2007
Changed 32-QFN from punched to SAWN.
Removed the leaded package option.
1.7
1/17/2008
Changed the bottom view package dimension for 32-QFN package.
2.0
2/23/2009
Removed all references to the 32-pin TQFP package.
Formatted to the new corporate standard.
2.1
3/9/2010
Added the schematic and bill of materials in Section 10.
Formatted to the new corporate standard.
2010 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
MicroDAA is a registered trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 73M1903-EVM-ETSI | 功能描述:網(wǎng)絡開發(fā)工具 73M1903 w/Etsi 203 Complex Imped. Term RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V |
| 73M1903-EVM-WW | 功能描述:BOARD DEMO 73M1903 PPU WORLDWIDE RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:- 產(chǎn)品培訓模塊:Obsolescence Mitigation Program 標準包裝:1 系列:- 主要目的:電源管理，電池充電器 嵌入式:否 已用 IC / 零件:MAX8903A 主要屬性:1 芯鋰離子電池 次要屬性:狀態(tài) LED 已供物品:板 |
| 73M1903-IM/F | 功能描述:電信線路管理 IC Modem AFE V.22Bis-V.92 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| 73M1903-IM/F1 | 功能描述:電信線路管理 IC RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| 73M1903-IMR/F | 功能描述:電信線路管理 IC Modem AFE V.22Bis-V.92 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
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