參數(shù)資料
型號(hào): 73M2901CLIH
廠商: TDK Corporation
英文描述: V.22 BIS SINGLE CHIP MODEM
中文描述: .22結(jié)算單芯片調(diào)制解調(diào)器
文件頁數(shù): 11/18頁
文件大?。?/td> 282K
代理商: 73M2901CLIH
73M2901CL
V.22bis Single Chip Modem
MODEM PERFORMANCE
CHARACTERISTICS
11
The curves presented in this data sheet define
modem IC performance under a variety of line
conditions typical of those encountered over Public
Switched Telephone Network.
BER VS. SNR
This test represents the ability of the modem to
operate over noisy lines with a minimum amount of
data transfer errors. Since some noise is generated
in the best dial up lines, the modem must operate
with the lowest signal to noise ratio (SNR) possible.
Better modem performance is indicated by test
curves that are closest to the BER axis. A narrow
spread between curves representing the four line
parameters indicates minimal variation in
performance while operating over a range of typical
operating conditions. A DPSK modem will exhibit
better BER performance test curves receiving in the
low band (answer mode) than in the high band
(originate mode).
BER VS. RECEIVE LEVEL
This test measures the dynamic range of the
modem. Because signal levels vary widely over dial
up lines, the widest possible dynamic range is
desirable. The SNR is held constant at the indicated
values as the Receive level is lowered from a very
high to a very low signal level. The width of the bowl
of these curves, taken at the BER break points is the
measure of the dynamic range.
RECOMMENDED SCHEMATIC ARRANGEMENT
HRIB
RTSB
RXA
VCC3_3D
VCC3_3A
RXDB
D
TXAP
VBG
VREF
R13
21K
VCC3_3D
+
C9
22uF
RST
C10
0.1uF
HOOKB
J1
CON10
1
2
3
4
5
6
7
8
9
10
RXDB
R23
NC
R2
2K
R28
120K
R17
475
O
C3
33pF
DTRB
C
TXAN
LIUCHECKB
U2
LDA110*
1
2
4
6
5
+
C1
10uF
O
U4
TLP627
1
2
4
3
C14
0.1uF
C11
0.1uF
R16
100
+
C12
10uF
ISOLATION BARRIER
VCC3_3
RXA_TAP
T1
671-8005
3
2
4
1
R20
22K
U11P2
C
C4
.082UF
TXAN
VCC3_3D
DCDB
DSRB
O
RINGB/PPUB/LIUB/LREVB
VCC3_3D
C7
0.1uF
+
C13
10uF
VCC3_3A
Y1
11.0592 MHz
R1
10K
C8
0.1uF
R
C6
0.1uF
U10P2
R15
5.1K
VCC3_3D
U3
TLP627
1
2
4
3
VCC3_3D
RXA
U1
2901CL_TQFP32
29
30
31
32
28
27
26
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
1
1
2
2
2
2
25
2
USR20
RING
RELAY
RI
DTR
RXCLK
RXD
V
V
D
D
C
R
U
U
RESET
VPA
TXAN
TXAP
VREF
VBG
RXA
VNA
V
O
O
V
N
T
T
VPD
V
C2
27pF
R18
100
TXDB
TXAP
TXDB
T1P3
+
C5
10uF
D
RST
C20
0.1uF
[js1]
相關(guān)PDF資料
PDF描述
73M2901 Advanced Single Chip Modem(高級(jí)單芯片調(diào)制解調(diào)器)
7407 Hex Buffers with High Voltage Open-Collector Outputs
74125 Quad 3-STATE Buffer
74126 Quad 3-STATE Buffer
7413 Power MOSFET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
73M2901CL-IH/F 功能描述:電信線路管理 IC V.22bis Single-Chip Modem w/Cid Ppu Liu RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
73M2901CL-IHR/F 功能描述:電信線路管理 IC V.22bis Single-Chip Modem w/Cid Ppu Liu RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
73M2901CL-IM/F 制造商:Maxim Integrated Products 功能描述:V.22BIS MODEM W/ CID PPU LIU - Rail/Tube
73M2901-IG3 制造商:TDK 制造商全稱:TDK Electronics 功能描述:Advanced Single Chip Modem
73M2901-IGT 制造商:TDK 制造商全稱:TDK Electronics 功能描述:Advanced Single Chip Modem