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參數(shù)資料
| 型號(hào)： | 73S8010R-DB |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 10/25頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD DEMO 73S8010R 28-SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | * |
73S8010R Data Sheet
DS_8010R_022
18
Rev. 1.6
3.4
Card Power Supply
The card power supply is provided by the LDO regulator, and controlled by the digital ISO-7816-3
sequencer. Card voltage selection is carried out by bit 2 of the control register.
Choice of the VCC capacitor:
Depending on the application, the requirements in terms of both the VCC minimum voltage and the
transient currents that the interface must be able to provide to the card are different. An external
capacitor must be connected between the VCC pin and the card ground in order to guarantee stability of
the LDO regulator, and to handle the transient requirements. The type and value of this capacitor can be
optimized to meet the desired specification. Table 14 shows the recommended capacitors for each VPC
power supply configuration and applicable specification.
Table 14: Choice of VCC Pin Capacitor
3.5
Over-temperature Monitor
A built-in detector monitors die temperature. When an over-temperature condition occurs (resulting from
a heavily loaded card interface, including short circuits, for example), a card deactivation sequence is
initiated, and a fault condition is reported to the system controller (bit 4 of the status register is set and an
interrupt is generated).
3.6
On-chip Oscillator and Card Clock
The Teridian 73S8010R device has an on-chip oscillator that can generate the smart card clock using an
external crystal connected between the XTALIN and XTALOUT pins to set the oscillator frequency.
When the card clock signal is available from another source, it can be connected to the pin XTALIN, and
in this case, the XTALOUT pin should be left unconnected.
The card clock frequency may be chosen from 4 different division rates, defined by the Clksel2 and
Clksel1 bits (bits 5 and 6) of the I
2C Control register, as listed in Table 15.
Table 15: Card Clock Divisor Options
Specification Requirements
System Requirements
Specification
Min VCC Voltage
allowed during
transient current
Max Transient
Current Charge
Min VPC Power
Supply required
Capacitor
Type
Capacitor
Value
EMV 4.0
4.6 V
30 nA
s
4.75 V
X5R/X7R
with
ESR<100 m
Ω
3.3
ΩF
ISO-7816-3
4.5 V
20 nA
s
4.75 V
1
ΩF
Clksel2
Clksel1
Card Clock
0
Clkin / 8
0
1
Clkin / 4
1
0
Clkin / 2
1
Clkin (Xtalin)
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|---|---|
| 73S8010R-IL/F | 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-ILR/F | 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-IM/F | 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-IM/F1 | 功能描述:I2C 接口集成電路 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-IM/F2 | 功能描述:I2C 接口集成電路 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
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