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參數(shù)資料
| 型號(hào)： | 74AHC00PWDH |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通用總線功能 |
| 英文描述： | Quad 2-input NAND gate |
| 中文描述： | AHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14 |
| 封裝： | PLASTIC, TSSOP-14 |
| 文件頁(yè)數(shù)： | 12/16頁(yè) |
| 文件大?。?/td> | 74K |
| 代理商： | 74AHC00PWDH |
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1999 Sep 23
12
Philips Semiconductors
Product specification
Quad 2-input NAND gate
74AHC00; 74AHCT00
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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| 74AHCT02 | Quad 2-input NOR gate(四2輸入或非門) |
| 74AHC02 | LJT 100C 100#22D PIN RECP |
| 74AHC02PWDH | Quad 2-input NOR gate |
| 74AHCT02PWDH | Quad 2-input NOR gate |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHC00PW-Q100J | 制造商:NXP Semiconductors 功能描述:74AHC00PW-Q100/TSSOP14/REEL13/ 制造商:NXP Semiconductors 功能描述:NAND Gate 4-Element 2-IN CMOS 14-Pin TSSOP T/R 制造商:NXP Semiconductors 功能描述:74AHC00PW-Q100/TSSOP14/REEL13/ - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC GATE NAND QUAD 2INP 14-TSSOP |
| 74AHC00PW-T | 功能描述:邏輯門 QUAD 2-INPUT NAND GATE RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時(shí)間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| 74AHC00S14-13 | 制造商:Diodes Incorporated 功能描述:AHC HIGH PIN COUNT SO-14 T&R 2.5K - Tape and Reel 制造商:Diodes Incorporated 功能描述:IC GATE 2.5K SO14 制造商:Diodes Incorporated 功能描述:74AHC Series 5.5 V Surface Mount Quadruple 2-Input NAND Gate - SOIC-14 |
| 74AHC00T14-13 | 制造商:Diodes Incorporated 功能描述:AHC HIGH PIN COUNT TSSOP-14 T&R 2.5K - Tape and Reel 制造商:Diodes Incorporated 功能描述:74AHC Series 5.5 V Surface Mount Quadruple 2-Input NAND Gate - TSSOP-14 |
| 74AHC00U,029 | 制造商:NXP Semiconductors 功能描述: |
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