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參數(shù)資料
| 型號： | 74AHC164 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit serial-in/parallel-out shift register |
| 中文描述： | 8位serial-in/parallel-out移位寄存器 |
| 文件頁數(shù)： | 17/20頁 |
| 文件大?。?/td> | 92K |
| 代理商： | 74AHC164 |
2000 Aug 15
17
Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHC164_08 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit serial-in/parallel-out shift register |
| 74AHC164BQ | 制造商:NXP Semiconductors 功能描述:IC 8BIT SIPO SHIFT REG DHV |
| 74AHC164BQ,115 | 功能描述:計數(shù)器移位寄存器 5V 8-BIT S IN P OUT RoHS:否 制造商:Texas Instruments 計數(shù)器類型: 計數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
| 74AHC164BQ115 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| 74AHC164BQ-G | 功能描述:計數(shù)器移位寄存器 5V 8-BIT S IN P OUT SHIFT REG RoHS:否 制造商:Texas Instruments 計數(shù)器類型: 計數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
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