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參數(shù)資料
| 型號： | 74AHC1G66 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Bilateral switch |
| 中文描述： | 雙邊開關(guān) |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 74K |
| 代理商： | 74AHC1G66 |
2002 May 27
13
Philips Semiconductors
Product specification
2-input NAND gate
74AHC1G00; 74AHCT1G00
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHC1G66GV | 功能描述:模擬開關(guān) IC 3.3V SINGLE ANALOG SWITCH RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| 74AHC1G66GV,125 | 功能描述:模擬開關(guān) IC 3.3V SINGLE ANALOG RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| 74AHC1G66GV125 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| 74AHC1G66GV-Q100H | 功能描述:IC ANALOG SWITCH SPST 5TSOP 制造商:nexperia usa inc. 系列:汽車級，AEC-Q100 包裝:剪切帶（CT） 零件狀態(tài):Digi-Key 停止供應(yīng) 開關(guān)電路:SPST - 常開 多路復用器/解復用器電路:1:1 電路數(shù):1 導通電阻（最大值）:22 歐姆 通道至通道匹配（ΔRon）:- 電壓 -?電源，單（V+）:2 V ~ 5.5 V 電壓 - 電源，雙（V±）:- 開關(guān)時間（Ton, Tof）（最大值）:11ns，11ns -3db 帶寬:280MHz 電荷注入:- 溝道電容 （CS(off），CD（off））:10pF 電流 - 漏泄（IS（off））（最大值）:100nA 串擾:- 工作溫度:-40°C ~ 125°C（TA） 封裝/外殼:SC-74A，SOT-753 供應(yīng)商器件封裝:5-TSOP 標準包裝:1 |
| 74AHC1G66GW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bilateral switch |
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