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參數(shù)資料
| 型號： | 74AHC257 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Quad 2-input multiplexer; 3-state(四 通道2輸入多路復用器（三態(tài)）；) |
| 中文描述： | 四2輸入多路復用器，3態(tài)（四通道2輸入多路復用器（三態(tài)）;） |
| 文件頁數(shù)： | 15/20頁 |
| 文件大?。?/td> | 89K |
| 代理商： | 74AHC257 |
2000 Apr 03
15
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
74AHC257;
74AHCT257
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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| 74AHC377 | Octal D-type flip-flop with data enable; positive-edge trigger |
| 74AHC3GU04 | high-speed Si-gate CMOS device |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHC257_08 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad 2-input multiplexer 3-state |
| 74AHC257D | 功能描述:編碼器、解碼器、復用器和解復用器 QUAD 2-INPUT MULTIPLEXER RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| 74AHC257D,112 | 功能描述:編碼器、解碼器、復用器和解復用器 QUAD 2-INPUT RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| 74AHC257D,118 | 功能描述:編碼器、解碼器、復用器和解復用器 QUAD 2-INPUT RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| 74AHC257D-Q100J | 制造商:NXP Semiconductors 功能描述:74AHC257D-Q100/SO16/REEL13// 制造商:NXP Semiconductors 功能描述:74AHC257D-Q100/SO16/REEL13// - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC MUX QUAD 2-INPUT 16SOIC |
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