- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄360407 > 74AHC595 (NXP Semiconductors N.V.) 8-bit serial-in/serial or parallel-out shift register with output latches;3-state(帶輸出鎖存的8位串行輸入/串行或并行輸出移位寄存器；三態(tài)) PDF資料下載
參數(shù)資料
| 型號(hào)： | 74AHC595 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit serial-in/serial or parallel-out shift register with output latches;3-state(帶輸出鎖存的8位串行輸入/串行或并行輸出移位寄存器；三態(tài)) |
| 中文描述： | 8位serial-in/serial或并行輸出的移位寄存器輸出鎖存器，3態(tài)（帶輸出鎖存的8位串行輸入/串行或并行輸出移位寄存器，三態(tài)） |
| 文件頁(yè)數(shù)： | 19/20頁(yè) |
| 文件大小： | 103K |
| 代理商： | 74AHC595 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)當(dāng)前第19頁(yè)第20頁(yè)
2000 Mar 15
19
Philips Semiconductors
Product specification
8-bit serial-in/serial or parallel-out shift
register with output latches; 3-state
74AHC595; 74AHCT595
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 74AHCT595 | 8-bit serial-in/serial or parallel-out shift register with output latches;3-state(帶輸出鎖存的8位串行輸入/串行或并行輸出移位寄存器；三態(tài)) |
| 74AHC74 | Dual D-type flip-flop with set and reset; positive-edge trigger(帶置位和復(fù)位的雙D觸發(fā)器；上升沿觸發(fā)；) |
| 74AHC74PWDH | Dual D-type flip-flop with set and reset; positive-edge trigger |
| 74AHCT74PWDH | Dual D-type flip-flop with set and reset; positive-edge trigger |
| 74AHCT74 | Dual D-type flip-flop with set and reset; positive-edge trigger(帶置位和復(fù)位的雙D觸發(fā)器；上升沿觸發(fā)；) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHC595_09 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:NPN general-purpose double transistors output latches; 3-state |
| 74AHC595BQ | 制造商:NXP Semiconductors 功能描述:IC 8BIT SHFT REG TRI-ST DHVQFN16 制造商:NXP Semiconductors 功能描述:IC, 8BIT, SHFT REG, TRI-ST, DHVQFN16 制造商:NXP Semiconductors 功能描述:IC, 8BIT, SHFT REG, TRI-ST, DHVQFN16, Shift Register Function:Serial to Parallel |
| 74AHC595BQ,115 | 功能描述:計(jì)數(shù)器移位寄存器 5V 8 SHIFT REG OTPT RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
| 74AHC595BQ-G | 功能描述:計(jì)數(shù)器移位寄存器 5V 8 SHIFT REG OTPT LATCH 3S RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
| 74AHC595BQ-Q100,11 | 制造商:NXP Semiconductors 功能描述:74AHC595BQ-Q100/DHVQFN16/REEL7 - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC SHIFT REGISTER 8BIT 16DHVQFN |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。