- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄360408 > 74AHCT374 (NXP Semiconductors N.V.) Quadruple 2-Input Positive-AND Gates 14-TSSOP -40 to 85 PDF資料下載
參數(shù)資料
| 型號(hào)： | 74AHCT374 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Quadruple 2-Input Positive-AND Gates 14-TSSOP -40 to 85 |
| 中文描述： | 八路D型觸發(fā)器，上升沿觸發(fā)，三態(tài) |
| 文件頁數(shù)： | 17/20頁 |
| 文件大?。?/td> | 93K |
| 代理商： | 74AHCT374 |
1999 Sep 28
17
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger; 3-state
74AHC374;
74AHCT374
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 74AHC374PWDH | Octal D-type flip-flop; positive edge-trigger; 3-state |
| 74AHC374 | Quadruple 2-Input Positive-NOR Gates 14-TSSOP -40 to 85 |
| 74AHCT377 | Octal D-type flip-flop with data enable; positive-edge trigger(帶數(shù)據(jù)使能的八D觸發(fā)器；上升沿觸發(fā)；三態(tài)) |
| 74AHCT541 | Octal buffer/line driver; 3-state(八通道緩沖器/線驅(qū)動(dòng)器；三態(tài)；) |
| 74AHC541 | Octal buffer/line driver; 3-state |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHCT374D | 功能描述:觸發(fā)器 OCTAL D 3-STATE RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74AHCT374D,112 | 功能描述:觸發(fā)器 OCTAL D 3-STATE RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74AHCT374D,118 | 功能描述:觸發(fā)器 OCTAL D 3-STATE RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74AHCT374D-Q100J | 功能描述:IC D-TYPE POS TRG SNGL 20SO 制造商:nxp semiconductors 系列:汽車級(jí)，AEC-Q100，74AHCT 包裝:帶卷（TR） 零件狀態(tài):有效 功能:標(biāo)準(zhǔn) 類型:D 型 輸出類型:三態(tài) 元件數(shù):1 每元件位數(shù):8 頻率 - 時(shí)鐘:130MHz 不同 V，最大 CL 時(shí)的最大傳播延遲:10.4ns @ 5V，50pF 觸發(fā)器類型:正邊沿 電流 - 輸出高，低:8mA，8mA 電壓 - 電源:4.5 V ~ 5.5 V 電流 - 靜態(tài):4μA 輸入電容:3pF 工作溫度:-40°C ~ 125°C（TA） 安裝類型:表面貼裝 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 標(biāo)準(zhǔn)包裝:2,000 |
| 74AHCT374D-T | 功能描述:觸發(fā)器 OCTAL D 3-STATE RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。