參數(shù)資料
型號: 74F241SJ
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: 通用總線功能
英文描述: Octal Buffers/Line Drivers with 3-STATE Outputs
中文描述: F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20
封裝: 5.30 MM, EIAJ TYPE2, SOP-20
文件頁數(shù): 5/10頁
文件大?。?/td> 189K
代理商: 74F241SJ
DC Electrical Characteristics
(Continued)
Symbol
Parameter
54F/74F
Units
V
CC
Conditions
Min
Typ
Max
I
CCH
Power Supply Current (’F240)
19
29
mA
Max
V
O
e
HIGH
V
O
e
LOW
V
O
e
HIGH Z
V
O
e
HIGH
I
CCL
Power Supply Current (’F240)
50
75
mA
Max
I
CCZ
Power Supply Current (’F240)
42
63
mA
Max
I
CCH
Power Supply Current
(’F241, ’F244)
40
60
mA
Max
I
CCL
Power Supply Current
(’F241, ’F244)
60
90
mA
Max
V
O
e
LOW
I
CCZ
Power Supply Current
(’F241, ’F244)
60
90
mA
Max
V
O
e
HIGH Z
AC Electrical Characteristics
74F
54F
74F
T
A
e a
25
§
C
V
CC
e a
5.0V
C
L
e
50 pF
T
A
, V
CC
e
Mil
C
L
e
50 pF
T
A
, V
CC
e
Com
C
L
e
50 pF
Symbol
Parameter
Units
Min
Typ
Max
Min
Max
Min
Max
t
PLH
t
PHL
Propagation Delay
Data to Output (’F240)
3.0
2.0
5.1
3.5
7.0
4.7
3.0
2.0
9.0
6.0
3.0
2.0
8.0
5.7
ns
t
PZH
t
PZL
Output Enable Time (’F240)
2.0
4.0
3.5
6.9
4.7
9.0
2.0
4.0
6.5
10.5
2.0
4.0
5.7
10.0
ns
t
PHZ
t
PLZ
Output Disable Time (’F240)
2.0
2.0
4.0
6.0
5.3
8.0
2.0
2.0
6.5
12.5
2.0
2.0
6.3
9.5
t
PLH
t
PHL
Propagation Delay
Data to Output (’F241, ’F244)
2.5
2.5
4.0
4.0
5.2
5.2
2.0
2.0
6.5
7.0
2.5
2.5
6.2
6.5
ns
t
PZH
t
PZL
Output Enable Time
(’F241, ’F244)
2.0
2.0
4.3
5.4
5.7
7.0
2.0
2.0
7.0
8.5
2.0
2.0
6.7
8.0
ns
t
PHZ
t
PLZ
Output Disable Time
(’F241, ’F244)
2.0
2.0
4.5
4.5
6.0
6.0
2.0
2.0
7.0
7.5
2.0
2.0
7.0
7.0
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
240/241/244
*
S
C
X
Temperature Range Family
74F
e
Commercia
54F
e
Military
Special Variations
QB
e
Military grade device with
environmental and burn-in
processing
X
e
devices shipped in 13
×
reel
Device Type
Package Code
Temperature Range
C
e
Commercial (0
§
C to
a
70
§
C)
M
e
Military (
b
55
§
C to
a
125
§
C)
NOTE:
Not required for MSA package
code
P
e
Plastic DIP
D
e
Ceramic DIP
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC JEDEC
*
MSA
e
Shrink Small Outline Package (EIAJ SSOP)
(’244 only)
SJ
e
Small Outline SOIC EIAJ
5
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