參數(shù)資料
型號(hào): 74HC04
廠商: NXP Semiconductors N.V.
元件分類: 電容
英文描述: CERAMIC CHIP/MIL-PRF-55681
中文描述: 陶瓷芯片/mil-prf-55681
文件頁數(shù): 14/20頁
文件大?。?/td> 109K
代理商: 74HC04
2003 Jul 23
14
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
PACKAGE OUTLINES
UNIT
A
max.
1
2
(1)
(1)
b
1
c
D
(1)
Z
E
e
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1
99-12-27
03-02-13
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
2.2
4.2
0.51
3.2
0.068
0.044
0.021
0.015
0.77
0.73
0.014
0.009
0.26
0.24
0.14
0.12
0.01
0.1
0.3
0.32
0.31
0.39
0.33
0.087
0.17
0.02
0.13
050G04
MO-001
SC-501-14
M
H
c
(e )
1
M
E
A
L
s
A
1
w
M
b
1
e
D
A
2
Z
14
1
8
7
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
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