參數(shù)資料
型號(hào): 74HC1G125GW,165
廠商: NXP Semiconductors
文件頁數(shù): 9/16頁
文件大小: 0K
描述: IC BUS BUFF DVR TRI-ST 5TSSOP
產(chǎn)品培訓(xùn)模塊: Logic Packages
標(biāo)準(zhǔn)包裝: 10,000
系列: 74HC
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相
元件數(shù): 1
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 7.8mA,7.8mA
電源電壓: 2 V ~ 6 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: 5-TSSOP
包裝: 帶卷 (TR)
其它名稱: 74HC1G125GW-R
74HC1G125GW-R-ND
935245690165
74HC_HCT1G125_5
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 — 23 December 2005
2 of 16
Philips Semiconductors
74HC1G125; 74HCT1G125
Bus buffer/line driver; 3-state
[1]
CPD is used to determine the dynamic power dissipation (PD in W).
PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of the outputs.
4.
Ordering information
5.
Marking
74HCT1G125
tPHL,
tPLH
propagation delay A to Y VCC =5V; CL =15pF
-
10
-
ns
Ci
input capacitance
-
1.5
-
pF
CPD
power dissipation
capacitance
VI = GND to VCC 1.5 V
[1] -27
-
pF
Table 1:
Quick reference data …continued
GND = 0 V; Tamb =25 °C; tr =tf ≤ 6.0 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74HC1G125
74HC1G125GW
40 °C to +125 °C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
74HC1G125GV
40 °C to +125 °C
SC-74A
plastic surface mounted package; 5 leads
SOT753
74HCT1G125
74HCT1G125GW
40 °C to +125 °C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
74HCT1G125GV
40 °C to +125 °C
SC-74A
plastic surface mounted package; 5 leads
SOT753
Table 3:
Marking
Type number
Marking code
74HC1G125GW
HM
74HC1G125GV
H25
74HCT1G125GW
TM
74HCT1G125GV
T25
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