參數(shù)資料
型號(hào): 74LCX573WMX
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 7/14頁(yè)
文件大小: 0K
描述: IC LATCH OCT LV 5V I/O 20SOIC
標(biāo)準(zhǔn)包裝: 1
系列: 74LCX
邏輯類型: D 型透明鎖存器
電路: 8:8
輸出類型: 三態(tài)
電源電壓: 2 V ~ 3.6 V
獨(dú)立電路: 1
延遲時(shí)間 - 傳輸: 1.5ns
輸出電流高,低: 24mA,24mA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: 74LCX573WMXDKR
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX573 Rev. 1.6.1
2
74LCX573
Lo
w
V
olta
g
e
Octal
Latc
h
with
5V
T
olerant
Inputs
and
Outputs
Connection Diagrams
Pin Assignments for
SOIC, SOP, SSOP, TSSOP
Pad Assignments for DQFN
(Top View)
Pin Descriptions
Logic Symbol
Truth Table
H = HIGH Voltage
L = LOW Voltage
Z = High Impedance
X = Immaterial
O0 = Previous O0 before HIGH-to-LOW transition of
Latch Enable
Functional Description
The LCX573 contains eight D-type latches with 3-STATE
output buffers. When the Latch Enable (LE) input is
HIGH, data on the Dn inputs enters the latches. In this
condition the latches are transparent, i.e., a latch output
will change state each time its D input changes. When
LE is LOW the latches store the information that was
present on the D inputs a setup time preceding the
HIGH-to-LOW transition of LE. The 3-STATE buffers are
controlled by the Output Enable (OE) input. When OE is
LOW, the buffers are enabled. When OE is HIGH the
buffers are in the high impedance mode but this does not
interfere with entering new data into the latches.
Pin Names
Description
D0–D7
Data Inputs
LE
Latch Enable Input
OE
3-STATE Output Enable Input
O0–O7
3-STATE Latch Outputs
D1
D2
D3
D4
D5
D6
D7
GND
D0
O1
O2
O3
O4
O5
O6
O7
O0
LE
VCC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
D1
D2
D3
D4
D5
D6
D7
GND
D0
O1
O2
O3
O4
O5
O6
O7
LE
O0
VCC
120
2
3
4
5
6
7
8
9
10
11
19
18
17
16
15
14
13
12
OE
Inputs
Outputs
OE
LE
D
On
LH
H
LH
L
LL
X
O0
HX
X
Z
D0 D1 D2 D3 D4 D5 D6 D7
O0
OE
LE
O1 O2 O3 O4 O5 O6 O7
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate
propagation delays.
D0
O0
D
Q
LE
OE
D1
O1
D
Q
LE
D2
O2
D
Q
LE
D3
O3
D
Q
LE
D4
O4
D
Q
LE
D5
O5
D
Q
LE
D6
O6
D
Q
LE
D7
O7
D
Q
LE
(Bottom View)
DAP
No Connect
Note: DAP (Die Attach Pad)
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