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參數(shù)資料
| 型號(hào)： | 74LS08 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | LOW POWER SCHOTTKY |
| 中文描述： | 低功耗肖特基 |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大小： | 75K |
| 代理商： | 74LS08 |
SN74LS08
http://onsemi.com
3
PACKAGE DIMENSIONS
1
7
14
8
B
A
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
0.715
0.240
0.145
0.015
0.040
0.100 BSC
0.052
0.008
0.115
0.290
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
18.80
6.60
4.69
0.53
1.78
MILLIMETERS
INCHES
2.54 BSC
1.32
0.20
2.92
7.37
0.095
0.015
0.135
0.310
2.41
0.38
3.43
7.87
–––
0.015
10
–––
0.38
10
1.01
0.039
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
H
G
D
K
C
SEATING
N
–T–
14 PL
0.13 (0.005)
M
L
M
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUMMOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUMMATERIAL CONDITION.
–A–
–B–
G
P
7 PL
14
8
7
1
M
0.25 (0.010)
B
M
S
B
M
0.25 (0.010)
A
S
T
–T–
SEATING
F
R
X 45
D
14 PL
K
C
J
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
0
5.80
0.25
MAX
8.75
4.00
1.75
0.49
1.25
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
0
0.228
0.010
MAX
0.344
0.157
0.068
0.019
0.049
INCHES
MILLIMETERS
0.25
0.25
7
6.20
0.50
0.009
0.009
7
0.244
0.019
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
ISSUE M
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