參數(shù)資料
型號(hào)： 80960
廠商： Intel Corp.
英文描述： 3.3 V EMBEDDED 32-BIT MICROPROCESSOR
中文描述： 3.3伏嵌入式32位微處理器
文件頁(yè)數(shù)： 3/78頁(yè)
文件大?。?/td> 835K
代理商： 80960
Advance Information Datasheet
3
80960JA/JF/JD/JT 3.3 V Microprocessor
Contents
1.0
2.0
Introduction
..................................................................................................................7
80960Jx Overview
......................................................................................................7
2.1
80960 Processor Core ..........................................................................................9
2.2
Burst Bus.............................................................................................................10
2.3
Timer Unit............................................................................................................10
2.4
Priority Interrupt Controller..................................................................................10
2.5
Instruction Set Summary.....................................................................................11
2.6
Faults and Debugging.........................................................................................11
2.7
Low Power Operation..........................................................................................11
2.8
Test Features......................................................................................................12
2.9
Memory-Mapped Control Registers ....................................................................12
2.10
Data Types and Memory Addressing Modes......................................................12
Package Information
...............................................................................................14
3.1
Pin Descriptions ..................................................................................................16
3.1.1
Functional Pin Definitions.......................................................................16
3.1.2
80960Jx 132-Lead PGA Pinout..............................................................22
3.1.3
80960Jx 132-Lead PQFP Pinout............................................................26
3.1.4
80960Jx 196-Ball MPBGA Pinout ..........................................................29
3.2
Package Thermal Specifications.........................................................................34
3.3
Thermal Management Accessories.....................................................................38
3.3.1
Heatsinks................................................................................................38
Electrical Specifications
........................................................................................39
4.1
Absolute Maximum Ratings.................................................................................39
4.2
Operating Conditions...........................................................................................39
4.3
Connection Recommendations...........................................................................40
4.4
VCC5 Pin Requirements (VDIFF) .......................................................................40
4.5
VCCPLL Pin Requirements.................................................................................41
4.6
DC Specifications................................................................................................42
4.7
AC Specifications................................................................................................44
4.7.1
AC Test Conditions and Derating Curves ..............................................47
4.7.2
AC Timing Waveforms ...........................................................................52
Bus Functional Waveforms
..................................................................................58
5.1
Basic Bus States.................................................................................................68
5.2
Boundary-Scan Register.....................................................................................69
Device Identification
...............................................................................................74
Revision History
.......................................................................................................77
3.0
4.0
5.0
6.0
7.0
相關(guān)PDF資料
PDF描述
80960CA-16 SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960CA-25 SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960CA-33 80960CA-33, -25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960JD-33 EMBEDDED 32-BIT MICROPROCESSOR
80960JD-40 EMBEDDED 32-BIT MICROPROCESSOR
相關(guān)代理商/技術(shù)參數(shù)
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809600-000 制造商:TE Connectivity 功能描述:Heat Shrink Semi-Rigid Molded Boot ST Polyolefin 制造商:TE Connectivity 功能描述:202D242-3/86-0 - Bag 制造商:TE Connectivity 功能描述:BOOT MOLDED
80960CA-16 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960CA-25 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960CA-33 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:80960CA-33, -25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960CF-16 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:80960CF-40, -33, -25, -16 32-BIT HIGH-PERFORMANCE SUPERSCALAR EMBEDDED MICROPROCESSOR
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