參數(shù)資料
型號(hào)： 80960JT
廠商： Intel Corp.
英文描述： EMBEDDED 32-BIT MICROPROCESSOR
中文描述： 嵌入式32位微處理器
文件頁數(shù)： 37/78頁
文件大?。?/td> 835K
代理商： 80960JT
Advance Information Datasheet
37
80960JA/JF/JD/JT 3.3 V Microprocessor
Table 16.
Maximum T
A
at Various Airflows in °C (80960JD)
Airflow-ft/min (m/sec)
f
CLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
PQFP
Package
T
A
without Heatsink
33
25
20
16.67
61
70
75
79
73
79
82
86
76
82
85
87
81
86
88
90
85
88
90
92
86
90
91
93
PGA
Package
T
A
without Heatsink
33
25
20
16.67
58
68
73
78
68
75
79
83
76
82
85
87
80
84
87
89
81
86
88
90
83
87
89
91
T
with Omnidirectional
Heatsink
1
33
25
20
16.67
75
81
84
87
85
88
90
92
90
92
93
95
92
94
95
96
93
95
96
96
93
95
96
96
T
with Unidirectional
Heatsink
2
33
25
20
16.67
73
79
82
86
86
90
91
93
90
92
93
95
92
94
95
96
93
95
96
96
93
96
96
96
MPBGA
Package
T
A
without Heatsink
25
20
16.67
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
NOTES:
1.
0.248” high omnidirectional heatsink (AI alloy 6061, 41 mil fin width, 124 mil center-to-center fin spacing).
2. 0.250” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 146 mil center-to-center fin spacing).
Table 17.
Maximum T
A
at Various Airflows in °C (80960JA/JF)
Airflow-ft/min (m/sec)
f
CLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
PQFP
Package
For NG80960JA/JF
T
A
without Heatsink
33
25
16
79
84
89
86
89
92
87
90
93
90
92
95
92
94
96
93
94
96
For TG80960JA-25
T
A
without Heatsink
T
A
without Heatsink
25
84
89
90
92
94
94
PGA
Package
33
25
16
78
83
88
83
87
91
87
90
93
89
92
94
90
92
95
91
93
95
T
with Omnidirectional
Heatsink
1
33
25
16
87
90
93
92
94
96
95
96
97
96
97
98
96
97
98
96
97
98
T
A
with Unidirectional
Heatsink
33
25
16
86
89
92
93
94
96
95
96
97
96
97
98
96
97
98
96
97
98
MPBGA
Package
T
A
without Heatsink
33
25
16
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
NOTES:
1.
0.248” high omnidirectional heatsink (AI alloy 6061, 41 mil fin width, 124 mil center-to-center fin spacing).
2. 0.250” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 146 mil center-to-center fin spacing).
相關(guān)PDF資料
PDF描述
80960JF 3.3 V EMBEDDED 32-BIT MICROPROCESSOR
80960 3.3 V EMBEDDED 32-BIT MICROPROCESSOR
80960CA-16 SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960CA-25 SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
80960CA-33 80960CA-33, -25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
80960KA 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR
80960KB 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT
80960MC 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT AND MEMORY MANAGEMENT UNIT
80960SA 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS
80960SB 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS
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