參數(shù)資料
| 型號： | 8343 |
| 廠商： | 3M |
| 文件頁數(shù)： | 4/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | WORKSURFACE RIGID ESD DISSP BGE |
| 標準包裝： | 1 |
| 系列： | 8300 |
| 墊子類型： | 桌子，工作臺 |
| 形狀： | 矩形 |
| 長度： | 3'（0.91m） |
| 寬： | 2'（0.61m） |
| 厚度： | 0.13"（3.30mm） |
| 顏色： | 淺褐 |
| 材質： | Laminate |
| 特點： | 耗散 |
| 包括： | 接地軟線，接地卡扣 |
| 其它名稱： | 05400718618 98079815845 |
1
78-8136-3801-8
18.0 Troubleshooting Guide
Symptom
Problem Causes
Recommendations
Cracking
Moisture differences between
substrate and laminate
Condition properly prior to lamination
Precondition laminate to match end
use conditions
Poor adhesive bond
Follow manufacturer’s
recommendations closely
For highest bond, use thermoset
adhesives
Substrate flexing
Use thicker substrate
Support substrate with backer
Stress points
Radius inside corners of openings to
0.125 in. (3.2 mm) minimum
Poor Postforming
Cracking at bend point
Backside of laminate too cool
Heat to 325°F on backside, 350°
375°F on front
Ensure that proper temperature has
been reached prior to bending
Do not force bending
Heating too slowly; laminate cures
before bending is completed
Laminate must reach optimum
bending temperature within 3060 sec
Laminate too dry
Precondition laminate properly, add
moisture
Substrate uneven
Ensure that substrate is smooth,
straight, and of even curvature
Substrate should be larger than
laminate
Surface changes
Discoloration
Due to sunlight
Laminate not intended for outdoor use
Keep laminate away from direct
sunlight
Due to chemicals
Avoid prolonged exposure to bleaches,
acids, alkalis
Due to heat
Remove/insulate heat source
Dents/depressions due to substrate
imperfections
Use higherdensity, thicker, or
smoother substrate
Cover at least 80% of the bond
surfaces with adhesive
Shrinkage
Improper conditioning
Precondition materials properly
Adhesive failure
Increase amount of adhesive and
pressure
Chipping
Improper tools
Use carbidetipped blades with teeth
then cut into the top surface of the
laminate
Slow cutting speed
Increase cutting speed
Unsupported laminate
Support laminate sheet at the cutting
point
Blistering
Excessive heat
Remove/insulate heat source
Bumps
Foreign particles trapped between
laminate and substrate
Clean surfaces thoroughly before
laminating
Adhesive lumps between laminate and
substrate
Heat the surface and apply pressure
(roller, wood block and hammer, etc.)
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