ORDER CODE: XXXX - 0 - XX - 01 - XX - XX -10 - 0
BASIC PART #
SPECIFY CONTACT FINISH:
SPECIFY PACKAGING:
01 200
μ" TIN/LEAD OVER NICKEL
43 Discrete receptacles
27 30
μ" GOLD OVER NICKEL
67 Tape & Reel for SMT
CONTACT #
SHELL FINISH:
Receptacles can be assembled with a choice of
01 200
μ" TIN/LEAD OVER NICKEL
contacts, see page 203 for alternates available.
.048 DIA.
.038 DIA.
.028 DIA.
.010
.009
.060
.071
5359-0-43-01-10-27-10-0
Solder mount in .043±.003 PTH.
#10 Contact for .012-.017 pins.
5359
0577-0-43-01-21-27-10-0
Solder mount in .045±.003 PTH.
#21 Contact for .015-.022 pins.
0577
.100 DIA.
.078 DIA.
.068 DIA.
.030
.093
.125
.009
9873-0-XX-01-02-27-10-0
Solder mount in .083±.003 PTH.
#02 Contact for .040-.050 pins.
Also available on 12mm wide carrier
tape: 4,500 parts per 13” reel.
9873
.068 DIA.
.052 DIA.
.043 DIA.
.020
.089 .100
.009
4015-0-XX-01-30-27-10-0
Solder mount in .057±.003 PTH.
#30 Contact for .015-.025 pins.
Also available on 8mm wide carrier
tape: 5,500 parts per 13” reel.
4015
.120 DIA.
.098 DIA.
.075 DIA.
.067 DIA.
.018
.009
.110
.125
.150
5364-0-XX-01-23-27-10-0
Solder mount in .103±.003 PTH.
#23 Contact for .045-.065 pins.
Also available on 12mm wide carrier
tape: 2,000 parts per 13” reel.
5364
.078 DIA.
.062 DIA.
.056 DIA.
.051 DIA.
.020
.009
.089
.100
4280-0-XX-01-16-27-10-0
Solder mount in .067±.003 PTH.
#16 Contact for .022-.034 pins.
Also available on 8mm wide carrier
tape: 5,500 parts per 13” reel.
4280
.090 DIA.
.072 DIA.
.064 DIA.
.018
.125
.206
.009
0379-0-43-01-34-27-10-0
Solder mount in .077±.003 PTH.
#34 Contact for .032-.046 pins.
0379
0479-0-XX-01-34-27-10-0
Solder mount in .077±.003 PTH.
#34 Contact for .032-.046 pins.
Also available on 16mm wide carrier
tape: 2,500 parts per 13” reel.
0479
SPECIFICATIONS
SHELL MATERIAL:
Brass Alloy 360, 1/2 Hard
CONTACT MATERIAL:
Beryllium Copper Alloy 172, HT
SOLDER BARRIER:
Organic Fibre Plug
DIMENSION IN INCHES
TOLERANCES ON:
LENGTHS:
±.005
DIAMETERS: ±.002
ANGLES:
± 2°
These thru-hole (tubular) receptacles are designed for hand,
wave or reflow* soldering. The
ORGANIC FIBRE PLUG
barrier prevents solder, paste or flux from contaminating the
spring contact.
After soldering, the
OFP barrier is pushed out of the recep-
tacle when the device is plugged in.
All parts are available as discrete receptacles; but for SMT
assembly, certain receptacles are supplied on carrier tape
per EIA-481 to feed industry standard pick and place
machines.
*Intrusive reflow (also called "pin-in-paste") is a technique of using conven-
tional thru-hole components in a reflow soldering process. The receptacles
are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed on pads adjacent to the
holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-thru-holes and achieve
solder joints as reliable as wave soldering. The OFP barrier prevents solder paste from being picked-up inside the contact
during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume of paste required to fill
each hole.
PINS
M
A HINE
D
C
PR
EC
ISI
ON
PIN RECEPTACLES
With Organic Fibre Plug Solder Barrier
www.mill-max.com
516-922-6000