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參數(shù)資料
| 型號： | 8SOIC |
| 廠商： | SMSC Corporation |
| 英文描述： | 8 PIN SOIC PACKAGE OUTLINE |
| 中文描述： | 8針SOIC封裝概要 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 295K |
| 代理商： | 8SOIC |
8 PIN SOIC/SOIN PACKAGE OUTLINE
Notes:
1. All dimensions are in millimeters.
2. True position spread tolerance of each lead is ±0.125mm at maximum material condition.
3. Dimension "D" does not include mold flash, protrusions or gate burrs. Maximum mold flash, protrusions or gate
burrs is 0.15mm per end. Dimension "E1" does not include inter-lead flash or protrusion. Maximum inter-lead
flash or protrusion is 0.25mm per side. Dimensions "D" & "E1" are determined at the datum plane "H".
4. Dimensions "b" and "c" apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip.
5. Details of pin 1 identifier are optional, but must be located within the index area indicated.
6. Provided for reference only - contact your SMSC Regional Sales Office for latest information.
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
A
A2
A1
L
L1
SEATING PLANE
SIDE VIEW
ccc C
0°-8°
0.25
GAUGE PLANE
H
3-D VIEW
D
8X b
e
TOP VIEW
E1
C
3
INDEX AREA
(D/2 X E1/2)
1
2
8
E
2
4
END VIEW
c
4
3
SEE DETAIL "A"
5
DETAIL "A" (SCALE: 3/1)
Min
1.35
0.10
1.25
4.80
5.80
3.80
0.40
Nominal
-
-
-
4.90
6.00
3.90
-
1.05 REF
-
-
1.27 BSC
-
Max
1.75
0.25
1.65
5.00
6.20
4.00
0.90
Remarks
A
A1
A2
D
E
E1
L
L1
b
c
e
ccc
Overall Package Height
Standoff
Package Body Thickness
"X" Body Size
Lead Span
"Y" Body Size
Lead Foot Length
Lead Length
Lead Width
Lead Thickness
Lead Pitch
Coplanarity
0.31
0.17
0.51
0.25
-
0.10
Rev. 8/23/05
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