參數(shù)資料
型號: 934055656127
廠商: NXP SEMICONDUCTORS
元件分類: JFETs
英文描述: 41 A, 100 V, 0.039 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
封裝: PLASTIC, SC-46, 3 PIN
文件頁數(shù): 8/15頁
文件大?。?/td> 326K
代理商: 934055656127
Philips Semiconductors
BUK9535-100A; BUK9635-100A
TrenchMOS logic level FET
Product specication
Rev. 01 — 22 January 2001
2 of 15
9397 750 07808
Philips Electronics N.V. 2001. All rights reserved.
5.
Quick reference data
6.
Limiting values
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
100
V
ID
drain current (DC)
Tmb =25 °C; VGS =5V
41
A
Ptot
total power dissipation
Tmb =25 °C
149
W
Tj
junction temperature
175
°C
RDSon
drain-source on-state resistance
VGS =5V; ID = 25 A; Tj =25 °C30
35
m
VGS = 4.5 V; ID = 25 A; Tj =25 °C
39
m
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
100
V
VDGR
drain-gate voltage (DC)
RGS =20k
100
V
VGS
gate-source voltage (DC)
±10
V
VGSM
non-repetitive gate-source voltage
tp ≤ 50 s
±15
V
ID
drain current (DC)
Tmb =25 °C; VGS =5V;
41
A
Tmb = 100 °C; VGS =5V; Figure 2
29
A
IDM
peak drain current
Tmb =25 °C; pulsed; tp ≤ 10 s;
165
A
Ptot
total power dissipation
Tmb =25 °C; Figure 1
149
W
Tstg
storage temperature
55
+175
°C
Tj
operating junction temperature
55
+175
°C
Source-drain diode
IDR
reverse drain current (DC)
Tmb =25 °C
41
A
IDRM
pulsed reverse drain current
Tmb =25 °C; pulsed; tp ≤ 10 s
165
A
Avalanche ruggedness
WDSS
non-repetitive avalanche energy
unclamped inductive load; ID =40A;
VDS ≤ 100 V; VGS =5V; RGS =50 ;
starting Tmb =25 °C
125
mJ
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