Philips Semiconductors
Product specification
74F676
16-bit serial/parallel-in, serial-out shift register (3-State)
1990 Apr 18
4
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
–0.5 to +7.0
V
VIN
Input voltage
–0.5 to +7.0
V
IIN
Input current
–30 to +5.0
mA
VOUT
Voltage applied to output in High output state
–0.5 to +VCC
V
IOUT
Current applied to output in Low output state
40
mA
Tamb
Operating free-air temperature range
0 to +70
°C
Tstg
Storage temperature
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
SYMBOL
PARAMETER
MIN
NOM
MAX
UNIT
VCC
Supply voltage
4.5
5.0
5.5
V
VIH
High-level input voltage
2.0
V
VIL
Low-level input voltage
0.8
V
IIK
Input clamp current
–18
mA
IOH
High-level output current
–1
mA
IOL
Low-level output current
20
mA
Tamb
Operating free-air temperature range
0
70
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
NO TAG
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONSNO TAG
MIN
TYP
NO TAG
MAX
UNIT
VO
High level output voltage
VCC = MIN, VIL = MAX,
±10%VCC
2.5
V
VOH
High-level output voltage
CC
,
IL
,
VIH = MIN, IOH = MAX
±5%VCC
2.7
3.4
V
VO
Low level output voltage
VCC = MIN, VIL = MAX,
±10%VCC
0.30
0.50
V
VOL
Low-level output voltage
CC
,
IL
,
VIH = MIN, IOL = MAX
±5%VCC
0.30
0.50
V
VIK
Input clamp voltage
VCC = MIN, II = IIK
–0.73
–1.2
V
II
Input current at maximum input voltage
VCC = MAX, VI = 7.0V
100
A
IIH
High-level input current
VCC = MAX, VI = 2.7V
20
A
IIL
Low-level input current
VCC = MAX, VI = 0.5V
–0.6
mA
IOS
Short-circuit output currentNO TAG
VCC = MAX
–60
–150
mA
ICC
Supply current (total)
VCC = MAX
48
72
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value under the recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS should be performed last.