Philips Semiconductors
BUK9575-55A; BUK9675-55A
TrenchMOS logic level FET
Product specication
Rev. 01 — 9 February 2001
11 of 15
9397 750 07831
Philips Electronics N.V. 2001. All rights reserved.
10. Soldering
Dimensions in mm.
Fig 18. Reow soldering footprint for SOT404.
handbook, full pagewidth
MSD057
solder lands
solder resist
occupied area
solder paste
10.50
7.40
7.50
1.50
1.70
10.60
1.20
1.30
1.55
5.08
10.85
0.30
2.15
8.35
2.25
4.60
0.20
3.00
4.85
7.95
8.15
8.075
8.275
5.40
1.50