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參數(shù)資料
| 型號： | 934056345118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | 24 A BUF OR INV BASED PRPHL DRVR, PSSO2 |
| 封裝： | PLASTIC, SOT-428, DPAK-3 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 32K |
| 代理商： | 934056345118 |
Philips Semiconductors
Product specification
Logic level TOPFET
BUK139-50DL
D-PAK version of BUK118-50DL
MECHANICAL DATA
Fig.2. SOT428 surface mounting package
1, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT428
98-04-07
0
10
20 mm
scale
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)
SOT428
E
b2
D1
wA
M
bc
b1
L1
L
13
2
D
E1
HE
L2
Note
1. Measured from heatsink back to lead.
e1
e
A
A2
A
A1
y
seating plane
mounting
base
A1
(1)
D
max.
b
D1
max.
E
max.
HE
max.
w
y
max.
A2
b2
b1
max.
c
E1
min.
ee1
L1
min.
L2
L
A
max.
UNIT
DIMENSIONS (mm are the original dimensions)
0.2
mm
2.38
2.22
0.65
0.45
0.89
0.71
0.89
0.71
1.1
0.9
5.36
5.26
0.4
0.2
6.22
5.98
4.81
4.45
2.285
4.57
10.4
9.6
0.5
0.7
0.5
6.73
6.47
4.0
2.95
2.55
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.1 g
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
July 2001
5
Rev 2.000
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