參數資料
型號: 934056697127
廠商: NXP SEMICONDUCTORS
元件分類: JFETs
英文描述: 48 A, 55 V, 0.024 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA
封裝: PLASTIC, SMD, SC-63, DPAK-3
文件頁數: 6/13頁
文件大小: 283K
代理商: 934056697127
Philips Semiconductors
BUK9222-55A
TrenchMOS logic level FET
Product specication
Rev. 01 — 17 April 2001
2 of 13
9397 750 08223
Philips Electronics N.V. 2001. All rights reserved.
5.
Quick reference data
6.
Limiting values
[1]
IDM is limited by chip, not package.
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
55
V
ID
drain current (DC)
Tmb =25 °C; VGS =5V
48
A
Ptot
total power dissipation
Tmb =25 °C
103
W
Tj
junction temperature
175
°C
RDSon
drain-source on-state resistance
Tj =25 °C; VGS =5V; ID = 25 A
19
22
m
Tj =25 °C; VGS = 4.5 V; ID = 25 A
24
m
Tj =25 °C; VGS = 10 V; ID = 25 A
17
20
m
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
55
V
VDGR
drain-gate voltage (DC)
RGS =20k
55
V
VGS
gate-source voltage (DC)
±15
V
ID
drain current (DC)
Tmb =25 °C; VGS =5V;
48
A
Tmb = 100 °C; VGS =5V; Figure 2
34
A
IDM
peak drain current
Tmb =25 °C; pulsed; tp ≤ 10 s;
193
A
Ptot
total power dissipation
Tmb =25 °C; Figure 1
103
W
Tstg
storage temperature
55
+175
°C
Tj
operating junction temperature
55
+175
°C
Source-drain diode
IDR
reverse drain current (DC)
Tmb =25 °C
48
A
IDRM
pulsed reverse drain current
Tmb =25 °C; pulsed; tp ≤ 10 s
193
A
Avalanche ruggedness
WDSS
non-repetitive avalanche energy
unclamped inductive load; ID =48A;
VDS ≤ 55 V; VGS =5V; RGS =50 ;
starting Tj =25 °C
160
mJ
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