參數(shù)資料
型號(hào): 935152920112
廠商: NXP SEMICONDUCTORS
元件分類: 網(wǎng)絡(luò)接口
英文描述: DATACOM, INTERFACE CIRCUIT, PDIP8
封裝: PLASTIC, DIP-8
文件頁數(shù): 6/20頁
文件大小: 94K
代理商: 935152920112
2000 Jan 13
14
Philips Semiconductors
Product specication
CAN controller interface
PCA82C250
BONDING PAD LOCATIONS
Note
1. All coordinates (
m) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).
SYMBOL
PAD
COORDINATES(1)
xy
TXD
1
196
135
GND
2
1280
135
VCC
3
1767
135
RXD
4
2588
135
Vref
5
2594
1640
CANL
6
1689
1640
CANH
7
948
1640
Rs
8
196
1640
handbook, full pagewidth
PCA82C250U
1
TXD
8
Rs
7
CANH
6
CANL
5
V
ref
V
CC
2
GND
34
RXD
MGL945
y
2.79 mm
x
0
1.78
mm
Fig.12 Bonding pad locations.
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