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參數(shù)資料
| 型號(hào)： | 935205590118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 顯示驅(qū)動(dòng)器 |
| 英文描述： | LIQUID CRYSTAL DISPLAY DRIVER, PDSO56 |
| 封裝： | PLASTIC, VSOP-56 |
| 文件頁(yè)數(shù)： | 29/46頁(yè) |
| 文件大?。?/td> | 246K |
| 代理商： | 935205590118 |
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1998 Jul 30
35
Philips Semiconductors
Product specication
Universal LCD driver for low multiplex
rates
PCF8576C
12.1
Chip-on-glass cascadability in single plane
In chip-on-glass technology, where driver devices are
bonded directly onto glass of the LCD, it is important that
the devices may be cascaded without the crossing of
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the
PCF8576C bonding pad layout (Fig.30). Pads needing bus
interconnection between all PCF8576Cs of the cascade
are VDD, VSS, VLCD, CLK, SCL, SDA and SYNC. These
lines may be led to the corresponding pads of the next
PCF8576C through the wide opening between VLCD pad
and the backplane output pads.
The only bus line that does not require a second opening
to lead through to the next PCF8576C is VLCD, being the
cascade centre. The placing of VLCD adjacent to VSS
allows the two supplies to be tied together.
When an external clocking source is to be used, OSC of all
devices should be tied to VDD. The pads OSC, A0, A1, A2
and SA0 have been placed between VSS and VDD to
facilitate wiring of oscillator, hardware subaddress and
slave address.
13 BONDING PAD LOCATIONS
Fig.30 Bonding pad locations.
Chip dimensions: approximately 2.92
× 3.20 mm.
Pad area: 0.0121 mm2.
Bonding pad dimensions: 110
× 110 m.
S33
S32
S31
S29
S30
S28
S26
S25
S27
S24
S23
S22
S20
S21
S19
S18
S4
S6
S5
S7
S9
S10
S8
S11
S12
S13
S15
S14
S16
S17
OSC
A0
V
SYNC
SCL
CLK
SDA
S39
S38
S36
S37
S35
S34
A1
A2
2.92 mm
SA0
V
BP0
BP2
BP1
BP3
S1
S0
S2
S3
PCF8576C
DD
LCD
SS
3.20
mm
MBE536
1
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