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參數(shù)資料
| 型號： | 935233410112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO24 |
| 封裝： | PLASTIC, SOT-137, SO-24 |
| 文件頁數(shù)： | 28/39頁 |
| 文件大?。?/td> | 302K |
| 代理商： | 935233410112 |
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1999 Sep 24
34
Philips Semiconductors
Preliminary specication
YUV one chip picture improvement based on luminance
vector-, colour vector- and spectral processor
TDA9178
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(2)
suitable
Surface mount
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5) suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 9352370001 | 功能描述:HEAT SHRINK SLEEVE RoHS:是 類別:線纜，導(dǎo)線 - 管理 >> 標(biāo)簽，標(biāo)記 系列:HT-SCE 標(biāo)準(zhǔn)包裝:250 系列:CM-SCE 標(biāo)簽類型:標(biāo)準(zhǔn) 標(biāo)簽尺寸:2.00" x 0.25"（50.8mm x 6.4mm） 顏色:白 材質(zhì):聚烯烴 適用于相關(guān)產(chǎn)品:點(diǎn)陣打印機(jī) 包裝:* 工作溫度:-55°C ~ 135°C 其它名稱:A105291CM-SCE-TP-1/4-4H-9 |
| 935241-0001 | 制造商: 功能描述: 制造商:DIGITRAN 功能描述: 制造商:undefined 功能描述: |
| 935241-1 | 制造商:DIGITRAN 功能描述: 制造商:DTRAN 功能描述: |
| 935245650125 | 制造商:NXP Semiconductors 功能描述:Inverter 1-Element CMOS 5-Pin TSSOP T/R |
| 935248-90 | 制造商:JANCO 功能描述:935248-90 |
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