- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄24800 > 935260218122 (NXP SEMICONDUCTORS) SPECIALTY TELECOM CIRCUIT, XMA PDF資料下載
參數(shù)資料
| 型號： | 935260218122 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, XMA |
| 封裝： | 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 156K |
| 代理商： | 935260218122 |
Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Ht1moa3.doc/HS
Page 4 of 24
2 Specifications
2.1 Mechanical Properties
Width
(Proposed Punching Outline)
7.55 mm
Length
(Proposed Punching Outline)
11.75 mm
see also drawing in chapter 3
Overall Thickness
0.45 mm ± 0.03 mm
Film Thickness
0.16 mm ± 0.005 mm
Bondpad Size for
Transponder Coil / Module
Interconnection
1.9 x 3.5 mm
Suitable for Welding/Soldering/
Conductive Gluing
2.2 Materials
Tape
110 m
Glass epoxy
Copper Plating
35 m
ED copper
Bond Plating
Ni / Au
Suitable for Al and Au wire
bonding
Backside Plating
Ni / Au
Glob Top
Filled Epoxy
Thermal curing
2.3 Temperature Range
Operating
-25°C to +85°C
For packed transponder,
depending on type of package
Processing
150°C for 30 minutes
at a standard lamination
pressure for contactless smart
card plastic materials (e.g. PVC,
PET, ...)
Welding Parameters
max. 25 ms @ 500 °C
on bond pads
Soldering Parameters
max. 3 s @ 390 °C
on bond pads
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 0721 | 35 A, MODULAR TERMINAL BLOCK |
| 935260091112 | SPECIALTY TELECOM CIRCUIT, PDSO14 |
| 935260092118 | SPECIALTY TELECOM CIRCUIT, PDSO14 |
| 0722BG | DUAL ISOLATED DC/DC CONVERTER |
| 935260154518 | 9 1-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, PQFP52 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 935261069122 | 制造商:NXP Semiconductors 功能描述:IC SECURITY TRANSPONDER PLLMC |
| 935262025112 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935262217118 | 制造商:NXP Semiconductors 功能描述:Real Time Clock Serial 8-Pin SO T/R |
| 935264217557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935267356112 | 制造商:NXP Semiconductors 功能描述:IC TEA1507PN |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。