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參數(shù)資料
| 型號(hào)： | 935261617112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 24-BIT DAC, PDSO32 |
| 封裝： | 7.50 MM, PLASTIC, SO-32 |
| 文件頁(yè)數(shù)： | 12/31頁(yè) |
| 文件大?。?/td> | 199K |
| 代理商： | 935261617112 |
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2000 Jan 04
2
Philips Semiconductors
Preliminary specication
Multi-channel lter DAC
UDA1328T
CONTENTS
1
FEATURES
1.1
General
1.2
Multiple format input interface
1.3
Multi-channel DAC
1.4
Advanced audio configuration
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
ORDERING INFORMATION
5
QUICK REFERENCE DATA
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
System clock
8.2
Application modes
8.3
Interpolation filter (DAC)
8.4
Digital silence detection
8.5
Noise shaper
8.6
Filter Stream DAC
8.7
Static Mode
8.7.1
System clock setting
8.7.2
De-emphasis control
8.7.3
Digital interface formats
8.8
L3 mode
8.8.1
Digital interface formats
8.8.2
L3 address
9
L3 INTERFACE DESCRIPTION
9.1
Address mode
9.2
Data transfer mode
9.2.1
Programming the sound processing and other
features
9.2.2
Reset bit
9.2.3
System clock frequency
9.2.4
Data input format
9.2.5
Quick mute
9.2.6
Power control
9.3
Feature settings
9.3.1
Volume control
9.3.2
Sub volume control
9.3.3
Mute
9.3.4
Digital silence mode
9.3.5
De-emphasis
9.3.6
Output polarity control
10
LIMITING VALUES
11
HANDLING
12
THERMAL CHARACTERISTICS
13
QUALITY SPECIFICATION
14
DC CHARACTERISTICS
15
AC CHARACTERISTICS (ANALOG)
16
AC CHARACTERISTICS (DIGITAL)
17
APPLICATION INFORMATION
18
PACKAGE OUTLINE
19
SOLDERING
19.1
Introduction to soldering surface mount
packages
19.2
Reflow soldering
19.3
Wave soldering
19.4
Manual soldering
19.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
20
DEFINITIONS
21
LIFE SUPPORT APPLICATIONS
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