參數(shù)資料
型號(hào)： 935262891026
廠商： NXP SEMICONDUCTORS
元件分類： 數(shù)字傳輸電路
英文描述： ATM/SONET/SDH SUPPORT CIRCUIT, UUC32
封裝： DIE-32
文件頁(yè)數(shù)： 2/30頁(yè)
文件大?。?/td> 211K
代理商： 935262891026
1999 Nov 03
10
Philips Semiconductors
Product specication
SDH/SONET STM1/OC3 postamplier
TZA3034
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134.
HANDLING
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the VCC and GND pads first, the remaining pads may then be bonded to their external
connections in any order.
THERMAL CHARACTERISTICS
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
57
× 57 × 1.6 mm FR4 epoxy printed-circuit board with 35 m thick copper traces. The measurements are performed
in still air.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VCC
supply voltage
0.5
+6
V
Vn
DC voltage
pins DIN, DINQ, CF, JAM and RSET
0.5
VCC + 0.5
V
pins STQ, ST, DOUTQ and DOUT
VCC 2VCC + 0.5
V
pin Vref
0.5
+3.2
V
In
DC current
pins DIN, DINQ, CF and JAM
1+1
mA
pins STQ, ST, DOUTQ and DOUT
25
+10
mA
pin Vref
2
+2.5
mA
pin RSET
2+2
mA
Ptot
total power dissipation
300
mW
Tstg
storage temperature
65
+150
°C
Tj
junction temperature
150
°C
Tamb
ambient temperature
40
+85
°C
SYMBOL
PARAMETER
CONDITION
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient note 1
SO16 package
115
K/W
TSSOP16 package
150
K/W
相關(guān)PDF資料
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