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參數(shù)資料
| 型號(hào)： | 935263363112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 網(wǎng)絡(luò)接口 |
| 英文描述： | DATACOM, INTERFACE CIRCUIT, PDSO8 |
| 封裝： | 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 |
| 文件頁數(shù)： | 5/23頁 |
| 文件大?。?/td> | 383K |
| 代理商： | 935263363112 |
2003 Oct 22
13
Philips Semiconductors
Product specication
High speed CAN transceiver
TJA1050
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
of each pad (in
m) with respect to the lefthand bottom
corner of the top aluminium layer (see Fig.13).
SYMBOL
PAD
COORDINATES(1)
xy
TXD
1
103
GND
2
740
85
VCC
3
886.5
111
RXD
4
1371.5
111
Vref
5
1394
1094
CANL
6
998
1115
CANH
7
538.5
1115
S
8
103
1097
Fig.13 Bonding pad locations.
handbook, halfpage
MGS381
8
TJA1050U
76
5
1
23
4
y
x
0
test pad
The backside of the bare die must be connected to ground.
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