參數(shù)資料
型號(hào): 935263511026
廠商: NXP SEMICONDUCTORS
元件分類(lèi): 通信及網(wǎng)絡(luò)
英文描述: SPECIALTY TELECOM CIRCUIT, UUC13
封裝: DIE-13
文件頁(yè)數(shù): 14/29頁(yè)
文件大小: 236K
代理商: 935263511026
2000 Mar 28
21
Philips Semiconductors
Product specication
Gigabit Ethernet/Fibre Channel
transimpedance amplier
TZA3043; TZA3043B
PACKAGE OUTLINE
UNIT
A
max.
A1
A2
A3
bp
cD(1)
E(2)
(1)
eHE
LLp
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w M
θ
A
A1
A2
b p
D
HE
L p
Q
detail X
E
Z
e
c
L
v M A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
97-05-22
99-12-27
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