參數(shù)資料
型號: 935263840026
廠商: NXP SEMICONDUCTORS
元件分類: 其它接口
英文描述: SPECIALTY INTERFACE CIRCUIT, UUC40
封裝: DIE-40
文件頁數(shù): 16/35頁
文件大?。?/td> 209K
代理商: 935263840026
2000 Feb 22
23
Philips Semiconductors
Product specication
SDH/SONET STM4/OC12 laser drivers
TZA3001AHL; TZA3001BHL;
TZA3001U
BONDING PAD LOCATIONS
Note
1. All x and y coordinates represent the position of the
centre of the pad in
m with respect to the centre of the
die (see Fig.20).
SYMBOL
PAD
COORDINATES(1)
xy
GND
1
664
910
MONIN
2
524
910
GND
3
367
910
IGM
4
227
910
TONE
5
70
910
TZERO
6
+87
910
BGAP
7
+244
910
VCC(G)
8
+384
910
VCC(G)
9
+524
910
GND
10
+664
910
GND
11
+910
630
VCC(B)
12
+910
490
VCC(B)
13
+910
350
GND
14
+910
210
LAQ
15
+910
70
LA
16
+910
+70
GND
17
+910
+210
BIAS
18
+910
+350
GND
19
+910
+490
GND
20
+910
+630
GND
21
+681
+910
ALARMHI
22
+541
+910
VCC(R)
23
+384
+910
DLOOP
24
+227
+910
DLOOPQ
25
+87
+910
VCC(R)
26
70
+910
ALARMLO
27
210
+910
ONE
28
367
+910
ZERO
29
524
+910
GND
30
681
+910
GND
31
910
+681
ALARM
32
910
+541
ENL
33
910
+384
VCC(R)
34
910
+227
DIN
35
910
+70
DINQ
36
910
70
VCC(R)
37
910
227
ALS
38
910
367
GND
39
910
551
GND
40
910
664
SYMBOL
PAD
COORDINATES(1)
xy
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