參數(shù)資料
型號(hào): 935272970005
廠商: NXP SEMICONDUCTORS
元件分類: 通信及網(wǎng)絡(luò)
英文描述: SPECIALTY TELECOM CIRCUIT, UUC
封裝: WAFER
文件頁(yè)數(shù): 5/11頁(yè)
文件大?。?/td> 1386K
代理商: 935272970005
3
PUBLIC INFORMATION
Philips Semiconductors
Product Specification Revision 3.1 2006 July 18
HITAG S
HTS IC H32/HTS IC H56/HTS IC H48
1
FEATURES
Integrated Circuit for Contactless Identification
Transponders and Cards
Integrated resonance capacitor of 210 pF with ± 5 %
tolerance over full production
Frequency range 100..150 kHz.
1.1
Protocol
Modulation Read/Write Device → Transponder:
100 % ASK and Binary Pulse Length Coding
Modulation Transponder → Read/Write Device: Strong
ASK modulation with Anticollision, Manchester and
Biphase Coding
Fast Anticollision Protocol for inventory tracking:
100 Tags in 3.2 seconds
Data integrity check (CRC)
Optional Transponder Talks First Modes with user
defined data length
Temporary switch from Transponder Talks First into
Reader Talks First Mode
Data Rate Read/Write Device to Transponder: 5.2 kBit/s
Data Rates Transponder to Read/Write Device: 2 kBit/s,
4kBit/s, 8kBit/s
1.2
Memory
Three memory options (32 Bit UID, 256 Bit, 2048 Bit)
More than 100000 erase/write cycles
10 years non - volatile data retention
Secure Memory Lock functionality
1.3
Supported Standards
Full compliant to ISO 11784/85 Animal ID
Targeted to operated on hardware infrastructure of new
upcoming standards
– ISO14223
(Animal ID with anticollision and read/write
functionality)
– ISO 18000-2
(AIDC Techniques-RFID or Item Management)
Supports German Waste Management Standard and
Pigeon Race Standard
1.4
Security Features
32 Bit Unique Identification Number (UID)
48 Bit secret key based encrypted authentication
1.5
Delivery Types
Sawn, gold - bumped 8” Wafer
Contactless Chip Card Module MOA2
I – Connect (Low Cost Flip Chip Package)
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