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參數(shù)資料
| 型號： | 935272973005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 8/11頁 |
| 文件大?。?/td> | 1386K |
| 代理商： | 935272973005 |
6
PUBLIC INFORMATION
Philips Semiconductors
Product Specification Revision 3.1 2006 July 18
HITAG S
HTS IC H32/HTS IC H56/HTS IC H48
4
BLOCKDIAGRAM
The HITAG S Transponder requires no external power supply. The contactless interface generates the power supply and
the system clock via the resonant circuitry by inductive coupling to the Read/Write Device (RWD). The interface also
demodulates data transmitted from the RWD to the HITAG S Transponder, and modulates the magnetic field for data
transmission from the HITAG S Transponder to the RWD.
Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity up to 2048 Bit and is organised in
64 Pages consisting of 4 Bytes each (1 Page = 32 Bits).
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REFERENCE DOCUMENTS
General Quality Specification
General Specification for 8” Wafer
Bumped Wafer Specification
Addendum Bumped Wafer Specification HTS IC H32/ HTS IC H56/ HTS IC H48 (electrical values)
Contactless Chip Card Module Specification
Addendum Contactless Chip Card Module Specification HTS MO H32/HTS MO H56/HTS MO H48
Flip Chip Package Specification
Addendum Flip Chip Package Specification HTS FC H32/HTS FC H56/HTS FC H48
Application Note HITAG S Coil Design Guide.
Fig.1 Block diagram.
64
P
a
g
e
s
32 Bit
Analogue RF Interface
Digital Control
EEPROM
Sequencer
Charge Pump
VDD
Data
In
Data
Out
Clock
R/W
Anticollision
Read/Write
Control
Access
Control
EEPROM Interface
Control
RF Interface
Control
PAD
VREG
V
RECT
DEMOD
Cres
MOD
PAD
CLK
Transponder
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