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參數(shù)資料
| 型號： | 935272976118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, UUC |
| 封裝： | FLIP CHIP PACKAGE |
| 文件頁數(shù)： | 7/11頁 |
| 文件大?。?/td> | 1386K |
| 代理商： | 935272976118 |
5
PUBLIC INFORMATION
Philips Semiconductors
Product Specification Revision 3.1 2006 July 18
HITAG S
HTS IC H32/HTS IC H56/HTS IC H48
3
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
DESCRIPTION
MEMORY
SIZE
ORDERING
CODE
PACKAGE
TEMPERATURE
RANGE (
°C)
HTS IC H32 01EW/V4
Sawn 8” wafer on foil (FFC),
150
m, inked and mapped,
with gold bumps
32 Bit
9352 729 70005
-25
°C to +85 °C
HTS IC H56 01EW/V4
256 Bit
9352 729 71005
HTS IC H48 01EW/V4
2048 Bit
9352 729 73005
HTS MO H32 01EV
MOA2 Package
32 Bit
9352 729 69118
SOT500AA1
-25
°C to +85 °C
HTS MO H56 01EV
256 Bit
9352 729 72118
HTS MO H48 01EV
2048 Bit
9352 729 74118
HTS FC H32 01EV/DH Flip Chip Package, Hot
Laminated
32 Bit
9352 729 75118
SOT732AA1
-25
°C to +85 °C
HTS FC H56 01EV/DH
256 Bit
9352 729 76118
HTS FC H48 01EV/DH
2048 Bit
9352 729 77118
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