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參數(shù)資料
| 型號(hào)： | 935275712512 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | I2C BUS CONTROLLER, PDSO20 |
| 封裝： | 7.50 MM, LEAD FREE, PLASTIC, MS-013AC, SOT-163-1, SO-20 |
| 文件頁(yè)數(shù)： | 3/10頁(yè) |
| 文件大?。?/td> | 180K |
| 代理商： | 935275712512 |
1997 Oct 21
2
Philips Semiconductors
Product specication
I2C-bus controller
PCF8584
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING
6
FUNCTIONAL DESCRIPTION
6.1
General
6.2
Interface Mode Control (IMC)
6.3
Set-up registers S0', S2 and S3
6.4
Own address register S0'
6.5
Clock register S2
6.6
Interrupt vector S3
6.7
Data shift register/read buffer S0
6.8
Control/status register S1
6.8.1
Register S1 control section
6.8.1.1
PIN (Pending Interrupt Not)
6.8.1.2
ESO (Enable Serial Output)
6.8.1.3
ES1 and ES2
6.8.1.4
ENI
6.8.1.5
STA and STO
6.8.1.6
ACK
6.8.2
Register S1 status section
6.8.2.1
PIN bit
6.8.2.2
STS
6.8.2.3
BER
6.8.2.4
LRB/AD0
6.8.2.5
AAS
6.8.2.6
LAB
6.8.2.7
BB
6.9
Multi-master operation
6.10
Reset
6.11
Comparison to the MAB8400 I2C-bus interface
6.11.1
Deleted functions
6.11.2
added functions
6.12
Special function modes
6.12.1
Strobe
6.12.2
Long-distance mode
6.12.3
Monitor mode
7
SOFTWARE FLOWCHART EXAMPLES
7.1
Initialization
7.2
Implementation
8I2C-BUS TIMING DIAGRAMS
9
LIMITING VALUES
10
HANDLING
11
DC CHARACTERISTICS
12
I2C-BUS TIMING SPECIFICATIONS
13
PARALLEL INTERFACE TIMING
14
APPLICATION INFORMATION
14.1
Application Notes
15
PACKAGE OUTLINES
16
SOLDERING
16.1
Introduction
16.2
DIP
16.2.1
Soldering by dipping or by wave
16.2.2
Repairing soldered joints
16.3
SO
16.3.1
Reflow soldering
16.3.2
Wave soldering
16.3.3
Repairing soldered joints
17
DEFINITIONS
18
LIFE SUPPORT APPLICATIONS
19 PURCHASE OF PHILIPS I2C COMPONENTS
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